Power electronics substrate for direct substrate cooling

By configuring turbulence inducing features on the surface of the power electronic substrate to form a turbulent thermal boundary layer, the problem of low cooling efficiency in traditional cooling methods is solved, efficient direct substrate cooling is achieved, and equipment weight and cost are reduced.

Inactive Publication Date: 2011-07-20
GM GLOBAL TECHNOLOGY OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these alternative cooling methods become less effective as the surface area of ​​the power electronics substrate increases compared to heat sinks

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The following detailed description is merely illustrative in nature and is not intended to limit the embodiments of the subject matter or the application or uses of such embodiments. As used herein, the word "example" means "serving as an example, instance, or illustration." Any implementation described herein as examples is not necessarily to be construed as preferred or advantageous over other implementations. In addition, any obvious or implied theory presented in the foregoing technical field, background technology, summary of the invention or the following specific embodiments shall not restrict the present invention.

[0051]Although the figures described below may depict one example arrangement of elements, additional intermediate elements, devices, features, or components may be present in embodiments of the described subject matter. In addition, specific terms may also be used in the following description for reference purposes only and are not intended to be ...

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PUM

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Abstract

The invention relates to a power electronics substrate for direct substrate cooling. Concretely, systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Description

[0001] Statement Regarding Federally Funded Research or Development [0002] This invention was made with government support under DE-FC26-07NT43123 awarded by the US Department of Energy. The government has certain rights in this invention. technical field [0003] Embodiments of the subject matter described herein relate generally to power electronics modules, and more particularly, embodiments of the subject matter relate to inverter power modules having substrates suitable for direct substrate cooling methods. Background technique [0004] Many electrical components generate heat as a by-product when they dissipate electrical energy. Overheating often affects the performance and reliability of electronic components, and therefore electrical equipment is routinely cooled to prevent overheating. [0005] In many power electronics applications, heat sinks are used when efficient heat dissipation is desired. Heat sinks absorb and dissipate heat from electrical components ...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L23/12H01L23/485H01L23/36H01L25/00H02M1/00
CPCH01L23/4735Y10S165/908H01L25/072H10W40/475H10W90/00
OwnerGM GLOBAL TECHNOLOGY OPERATIONS LLC