Inverter power module for with distributed support for direct substrate cooling

一种功率模块、逆变器的技术，应用在功率电子模块领域，能够解决功率电子基板弯曲、断裂、功率电子基板挠曲等问题

Active Publication Date: 2010-03-03
GM GLOBAL TECH OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the pressure or force generated by these cooling methods may cause the power electronic substrate to deflect, which can potentially cause the power electronic substrate to bend or break

Method used

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  • Inverter power module for with distributed support for direct substrate cooling
  • Inverter power module for with distributed support for direct substrate cooling
  • Inverter power module for with distributed support for direct substrate cooling

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Embodiment Construction

[0017] The following detailed description is merely exemplary in nature and is not intended to limit the subject matter embodiments or the application and uses of such embodiments. As used herein, the word "exemplary" means "serving as an example, instance, or illustration." Any implementation described herein as exemplary is not necessarily to be construed as superior or superior to other implementations. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the following detailed description.

[0018] In addition, certain terms may be used in the following description for reference purposes only, and thus these terms are not intended to be limiting. For example, the terms "upper", "lower", "top", "bottom" and the like refer to directions in the figures to which reference is made. These terms may include the words specifically mentioned above, derivatives thereof and words o...

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PUM

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Abstract

Systems and / or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frameis adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronicsubstrate and joined to the first support frame to form the seal.

Description

[0001] Statement Regarding Federally Funded Research and Development [0002] As specified in DE-FC26-07NT43123 promulgated by the U.S. Department of Energy, the U.S. government has a gratuitous license to this invention and has the right to require the patent owner to license others to practice it on reasonable terms under limited conditions. technical field [0003] Embodiments of the subject matter described herein generally relate to power electronics modules, and more specifically, embodiments of the subject matter relate to inverter power modules adapted for use with direct substrate cooling methods. Background technique [0004] Many electronic devices generate heat as a side effect of consuming electrical power. Overheating often affects the performance and stability of electronic devices, so electronic equipment is routinely cooled to prevent overheating. [0005] In most power electronics applications, heat sinks are used where efficient heat dissipation is desire...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L23/13H01L23/14H01L23/367H01L21/50H02M7/42
CPCH01L2224/48137H01L24/48H01L23/4735H01L2224/48095H01L24/49H01L2224/4809H01L25/072H01L2224/49111H01L2224/48472H01L2224/4847H01L23/3735H01L2224/49175H01L2924/13055H01L2924/1305H01L2224/48139H01L2924/00014H01L2924/181Y10T29/53122H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207
InventorD·H·米勒M·D·科里奇T·G·沃德B·S·曼
OwnerGM GLOBAL TECH OPERATIONS LLC