Surface mount diode and method of fabricating the same
A surface mount type and manufacturing method technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of wrong installation of positive and negative electrodes, difficulty in identification, etc.
Inactive Publication Date: 2011-08-03
KK TOSHIBA
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0003] However, in surface mount diodes with such a structure, since the anode and cathode are formed in the same shape, it is difficult to identify them, and when mounted on a circuit board, the orientation of the anode and cathode may be wrong.
Method used
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Embodiment Construction
[0019] Hereinafter, a surface mount diode according to an embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the drawings.
[0020] First, refer to figure 1 and figure 2 , the surface mount diode according to the embodiment of the present invention will be described.
[0021] Such as figure 1 and figure 2 As shown, the surface mount diode 1 of the present embodiment includes a diode chip 2, a negative electrode 3, a positive electrode 4, a first covering member 5, and a second covering member 6, and has a substantially square external structure.
[0022] The diode chip 2 has a first main surface A1 and a second main surface A2 opposite to each other.
[0023] In this embodiment, a PN junction diode is made as follows: For example, an N-type layer is formed on the first main surface A1 side, and a P-type layer is formed on the second main surface A2 side, for example, between the N-type layer and the ...
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The present invention relates to a surface mount diode and a method of fabricating the same. The diode includes a first main surface and a second main surface facing to each other; a cathode electrode including a first internal electrode portion on the first main surface and a first external electrode portion on the first internal electrode portion; an anode electrode including a second internal electrode portion on the second main surface and a second external electrode portion on the second internal electrode portion, a thickness of the second external electrode portion being the same as a thickness of the first external electrode portion; a first covering member covering a periphery surface of one of the internal electrode portions and a periphery surface of the diode chip; and a second covering member covering a periphery surface of the other of the internal electrode portions, the second covering member being different in color from the first covering member.
Description
technical field [0001] This embodiment relates to a surface mount type diode and a method of manufacturing the same. Background technique [0002] In recent years, in order to facilitate mounting on circuit boards, surface mount diodes have been structured as follows: a rectangular parallelepiped package has a positive electrode at one end and a negative electrode at the other end so that it can be mounted on any of four sides. [0003] However, in surface mount diodes with such a structure, since the anode and cathode are formed in the same shape, it is difficult to identify them, and when mounted on a circuit board, the orientation of the anode and cathode may be wrong. [0004] Therefore, it is desired that the positive electrode and the negative electrode be easily recognized in appearance. [0005] In response to this need, as disclosed in the prior art, a surface mount type diode has been proposed in which the polarities of the positive electrode and the negative elec...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L29/861H01L23/31H01L29/417H01L21/329H01L21/56
CPCH01L23/48H01L21/782H01L2924/0002H01L2924/00H01L2224/94H01L21/561H01L2924/00014H01L21/78H01L24/94H01L2924/181H01L33/36H01L33/44
Inventor 木谷智之东条启能木孝男樋口和人井口知洋福满昌子小幡进浅野佑策
Owner KK TOSHIBA