Light-emitting diode device

A technology of light-emitting diodes and encapsulation layers, used in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor white light quality and uneven color of light sources

Inactive Publication Date: 2011-08-10
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The color of the light source emitted by the light emitting diode device 1 is not uniform in all di

Method used

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Embodiment Construction

[0015] figure 2 Shown is a light emitting diode arrangement 2 according to a first embodiment of the invention. The light emitting diode device 2 has a substrate 21 , a light emitting diode chip 22 and a package body 23 . In this embodiment, the LED chip 22 is a blue LED with a vertical chip design and has a top surface 221 . Two electrodes 27 are respectively arranged on two sides of the LED chip, wherein the electrode 27 on the top surface 221 is also electrically connected to the other electrode 27 on the substrate 21 through a metal conductive wire. The package body 23 completely covers the LED chip 22 , the electrode 27 and the metal conductive wire, so as to provide proper protection for the LED chip 22 .

[0016] Although the LED chip 22 projects light in various directions, a larger part of the light is projected from a main luminous intensity direction 28 , which is a direction perpendicular to the top surface 221 . As the projection angle changes from the main lu...

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PUM

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Abstract

The invention discloses a light-emitting diode device. The light-emitting diode device comprises a substrate, a light-emitting diode chip and a packaging main body. The light-emitting diode chip is arranged on the substrate and comprises a top surface. The packaging main body is arranged on the substrate, completely covers the light-emitting diode chip and is provided with a first packaging layerand a second packaging layer. The first packaging layer and the second packaging layer are respectively made from a material containing a wavelength conversion substance. The first packaging layer ispositioned above the top surface and has higher percentage concentration by weight of the wavelength conversion substance relative to the second packaging layer.

Description

technical field [0001] The present invention relates to a light-emitting diode device; in particular, it relates to a light-emitting diode device with a wavelength conversion substance with non-uniform concentration distribution. Background technique [0002] Due to the advantages of small size, fast response, high efficiency and long life, light emitting diodes have broad application space whether they are used for display lighting or ambient lighting. Early LEDs were monochromatic LEDs, so it was necessary to mix multiple LED chips of different colors at the same time to provide a white light source. However, the cost of the white light emitting diode device manufactured by this method is too high to be conducive to industrial application. Therefore, with the development of LED manufacturing technology, a LED device capable of generating white light using a single chip has been proposed. [0003] figure 1 What is shown is a schematic diagram of a conventional single chi...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/50
CPCH01L2224/8592H01L2224/48091H01L2224/49107H01L2924/00014
Inventor 吕宗霖郭信男
Owner EVERLIGHT ELECTRONICS
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