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Substrate trimming processing device of liquid crystal display panel

A liquid crystal display panel and processing device technology, which is applied in the direction of fine working devices, glass cutting devices, stone processing equipment, etc., can solve the problems of inability to trim the substrate of the LCD panel, inability to trim, and unqualified

Active Publication Date: 2011-09-21
SHIRAI IRON WORKS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if the same method is used for liquid crystal display (hereinafter referred to as LCD) panels before ultraviolet light (hereinafter referred to as UV) curing substrate trimming, it will be because too much stress is applied to the liquid crystal substrate before polymer alignment treatment. , but can not be trimmed, resulting in substandard products
That is, it is not possible to trim the edge of the substrate for the LCD panel before the UV curing step

Method used

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  • Substrate trimming processing device of liquid crystal display panel
  • Substrate trimming processing device of liquid crystal display panel
  • Substrate trimming processing device of liquid crystal display panel

Examples

Experimental program
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Embodiment 1

[0031] Please refer to the first embodiment Figure 1 to Figure 10 As shown, A is the loading channel of the substrate X of the LCD panel before the UV curing step, B is a plurality of workbenches, which are arranged in parallel in front of the loading channel A along the loading direction, and have a plurality of ejection The small air hole 1 can eject air to make the substrate X float and generate suction to keep the substrate X and the workbench B at a certain distance. C is the output of the substrate X (sideline processed) that is transported from the workbench B and completed sideline processing the exit channel.

[0032] In this embodiment, the carrying-in channel A and the carrying-out channel C are a roller conveyor belt as shown in the figure, however, they are not limited thereto.

[0033] The plurality of workbenches B in this embodiment are provided with a hollow and wide box body 2 as shown in the figure, and the top wall of the box body 2 is provided with a plu...

Embodiment 2

[0070] Second, please refer to figure 2 , Figure 7 , Figure 11 To illustrate the second embodiment.

[0071] The edge of the substrate X is covered (embedded) up and down on the rear side of the scribing line travel direction formed by the cutter 39 of the cutter carriage 36, and a suction device with a suction port 81 is arranged on the lower surface side of the CF plate 12. Box 82.

[0072] A suction hose (not shown) is connected to the exhaust port 83 of the suction box 82 .

[0073] In this way, scraps at the time of scribing by the cutter 39 can be sucked into the suction box 82 .

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PUM

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Abstract

The invention discloses a substrate trimming processing device of a liquid crystal display panel, for processing without applying too much stress on a liquid crystal substrate before matching polymers, in the event of trimming a substrate of the liquid crystal display panel before performing an ultraviolet light hardening step. The device performs the cutting processing through the apparatuses as follows: a straight carrying-in channel; small hole workbenches arranged in parallel and for injecting floating air and keeping suction; taking-in claws arranged on a carrying-out channel and for conveying the substrate from the carrying-in channel to the workbenches; taking-out claws for conveying the substrate on the workbench to the carrying-out channel; and a torsion cutting device for scoring the lower surface forming a CF plate edge line of the substrate on the workbench by cutting and torsionally cutting the scored part.

Description

technical field [0001] The invention relates to a liquid crystal display panel processing device used for cutting the edge line of a substrate before ultraviolet (UV) hardening. Background technique [0002] The technique for cutting the edge of a glass substrate is well known (see Patent Document 1). [0003] Patent Document 1 is Japanese Unexamined Patent Publication No. 2010-26267. [0004] The processing method of Patent Document 1 is to create a cutting line on the glass substrate with a cutting knife, and then divide at the cutting line with a dividing device that applies stress. [0005] However, if the same method is used for liquid crystal display (hereinafter referred to as LCD) panels before ultraviolet light (hereinafter referred to as UV) curing substrate trimming, it will be because too much stress is applied to the liquid crystal substrate before polymer alignment treatment. , but can not be trimmed, resulting in substandard products. That is, it is not pos...

Claims

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Application Information

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IPC IPC(8): C03B33/02
CPCB28D5/0082C03B33/027C03B33/03C03B35/12C03B35/202G02F1/133351
Inventor 白井明村泽浩次
Owner SHIRAI IRON WORKS