Method for supporting analytical work of solder printing state and solder printing inspection machine
A state analysis and inspection machine technology, applied in the direction of analyzing materials, image analysis, printed circuits, etc., can solve problems such as no analysis, and achieve the effect of improving productivity
Active Publication Date: 2011-09-21
ORMON CORP
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- Description
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- Application Information
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Problems solved by technology
Therefore, it is desired to be able to identify the extracted board and analyze the manufacturing conditions and solder printing state when processing the board, but there is no conventional example where such analysis can be easily performed in the workshop.
Method used
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Embodiment Construction
[0056] figure 1 It is a block diagram showing the configuration of the solder printing inspection machine.
[0057] The solder printing inspection machine 100 is installed in a solder printing process of a component-mounted board production line, and is used to inspect whether the amount of solder printed on the electrodes (pads) on the board side, whether the printing range is appropriate, or the like.
[0058] Both the main control unit 101 and the sub-control unit 102 in the figure are computers having a CPU and a memory. In addition, the main control unit 101 includes a communication interface for network communication.
[0059] A camera 103 and a monitor 104 are connected to the main control part 101, and a conveyor belt (conveyer) 105, an illumination unit 106, a display lamp 107, an X stage (stage) part 108, a Y stage part 109, An operation unit 110, an interface 111 for external equipment, and the like.
[0060] as described later Figure 14 As shown, the monitor 1...
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Therefore, the user can easily recognize an influence of the extraction or reintroduction of the board on the quality in a solder printing step. In a solder printing inspection machine, an identification code and an inspection time of an inspection target board are accumulated in a memory. The accumulated data, whose identification code is matched with that of the current inspection target board, is searched while the accumulated data is traced back one by one. When the corresponding board is found, it is recognized that the board is extracted because of the defective board and the inspection target board is the reintroduced board that was previously extracted. A graph, in which pieces of information expressing the pieces of quality of the boards are arrayed in time series, is produced based on each time of inspection result and the graph is displayed on a monitor. In the pieces of data included in the graph, the data corresponding to the board that is recognized as the reintroduction is explicitly shown by a letter 'R'.
Description
technical field [0001] The present invention relates to a solder printing state analysis work support method and a solder printing inspection machine using the method. The solder print state analysis work support method is for inspecting the state of the solder on a board after printing cream solder with a solder printing machine and before mounting parts. Printing status, and support the job of analyzing the printing status of solder based on the inspection results. Background technique [0002] In the solder printing process, which is the first step in the production line of component-mounted boards, it is necessary to transfer an appropriate amount of solder to each of a plurality of electrodes (lands: lands) on the board. However, the quality of printed parts tends to deteriorate due to replacement of the mask on the solder printing machine, clogging of mask holes, and fluctuations in the supply amount of cream solder. [0003] In view of the above problems, the applica...
Claims
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IPC IPC(8): H05K13/08G01N21/956
CPCH05K2203/163G01B11/28H05K3/225H05K3/1216G01B11/06H05K13/08H05K13/0413G01B11/00H05K13/083B23K1/00G01B11/24H05K3/34G06T7/00
Inventor 森弘之
Owner ORMON CORP