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Bonding apparatus and bonding method

A bonding device and one-party technology are applied in lamination devices, identification devices, chemical instruments and methods, etc., which can solve the problems of reducing the visibility of the display surface and achieve the effect of simple composition

Active Publication Date: 2014-09-03
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if there is an air layer between the liquid crystal module, protective film, touch panel, etc. (hereinafter referred to as workpiece), the visibility of the display surface will be reduced due to the reflection of external light

Method used

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  • Bonding apparatus and bonding method

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Experimental program
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Embodiment Construction

[0038] Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[0039] (A. Composition)

[0040] (1. Overall composition)

[0041] First, the whole structure of the bonding apparatus (henceforth this apparatus) of this embodiment is demonstrated. Such as figure 1 As shown, this device is equipped with four holding devices 2 on the turntable 1 . The turntable 1 is configured to be intermittently rotated by an alignment mechanism (Index mechanism), not shown, to align the feeding and unloading position 1A, the lamination preparation position 1B, the positioning position 1C, and the vacuum lamination position 1D.

[0042] Such as figure 2 As shown, the holding device 2 is a device for holding the workpiece S1 placed on the placement unit 3 and the workpiece S2 held by the holding unit 4 facing each other up and down. In this embodiment, rectangular substrates such as liquid cr...

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PUM

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Abstract

The present invention provides a bonding device and a bonding method. The bonding device has a simple structure and can maintain a constant pressing force even if the position of a driving part changes. The bonding device has: a pressure head (52) for applying force to one workpiece (S2); a vacuum chamber (51) for sealing the space where the workpieces (S1, S2) are bonded by the pressure head (52); Connected to the vacuum chamber (51), the decompression pump (55) that can evacuate the inside of the vacuum chamber (51) into a vacuum; the driving part ( 54); a sensor (56) for detecting the position of the pressing head (52); a control device for controlling the pressing force of the driving part (54) based on the position of the pressing head (52) detected by the sensor (56) ( 6).

Description

technical field [0001] This invention relates to the bonding apparatus and bonding method which improved the technique of bonding flat workpieces, such as a liquid crystal module and a cover panel, for example. Background technique [0002] In general, a liquid crystal panel is constructed by laminating a liquid crystal module, a protective film for protecting the surface, a touch panel for operation, and the like. These liquid crystal modules, protective films, touch panels, etc. (hereinafter referred to as workpieces) are housed in the frame of the liquid crystal module, and a space is formed between them to avoid contact with the liquid crystal glass due to deformation of the protective panel and touch panel. [0003] However, if there is an air layer between the liquid crystal module, protective film, touch panel, etc. (hereinafter referred to as workpiece), the visibility of the display surface will be reduced due to the reflection of external light. In order to cope w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/1339B32B2309/68B32B37/12G11B7/26B32B37/10G02F1/1303B32B2457/202B29C65/78G02F1/13G09F9/00
Inventor 横田典之
Owner SHIBAURA MECHATRONICS CORP