Bonding apparatus and bonding method
A bonding device and one-party technology are applied in lamination devices, identification devices, chemical instruments and methods, etc., which can solve the problems of reducing the visibility of the display surface and achieve the effect of simple composition
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[0038] Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.
[0039] (A. Composition)
[0040] (1. Overall composition)
[0041] First, the whole structure of the bonding apparatus (henceforth this apparatus) of this embodiment is demonstrated. Such as figure 1 As shown, this device is equipped with four holding devices 2 on the turntable 1 . The turntable 1 is configured to be intermittently rotated by an alignment mechanism (Index mechanism), not shown, to align the feeding and unloading position 1A, the lamination preparation position 1B, the positioning position 1C, and the vacuum lamination position 1D.
[0042] Such as figure 2 As shown, the holding device 2 is a device for holding the workpiece S1 placed on the placement unit 3 and the workpiece S2 held by the holding unit 4 facing each other up and down. In this embodiment, rectangular substrates such as liquid cr...
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