Electronic device and heat dissipation device thereof

A heat dissipation device and technology for electronic equipment, applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve problems affecting installation stability, unfavorable heat dissipation, and excessive size of heat dissipation fins, etc., to achieve the benefit of heat dissipation Effect

Inactive Publication Date: 2012-03-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, electronic equipment, such as computers, servers, etc., are generally equipped with a main board, on which several heating elements, such as central processing unit, memory, etc., are installed, and the heat dissipation of the central processing unit is carried out by installing cooling fins on

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic device and heat dissipation device thereof
  • Electronic device and heat dissipation device thereof
  • Electronic device and heat dissipation device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] see Figure 1 to Figure 3 , the electronic device of the present invention includes a chassis 100 , a motherboard 10 installed in the chassis 100 and a heat dissipation device 20 .

[0025] A heating element 12 and a plurality of slots 14 are arranged on the motherboard 10 . In this embodiment, the heating element 12 is a CPU, and the slot 14 is an expansion card slot.

[0026] The heat dissipation device 20 includes a heat dissipation block 22 , a heat dissipation fin 24 , a card 26 fixed to the heat dissipation fin 24 , and a heat pipe 28 connected between the heat dissipation block 22 and the heat dissipation fin 24 . The heat dissipation fins 24 include a substrate 242 attached to the board 26 and a plurality of fins 244 vertically extending from the substrate 242 . The board 26 includes a socket portion 262 . The board card 26 and the cooling fins 24 can be fixed by screw locking or bonding. The board card 26 may be an expansion card or a fixing plate solely us...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an electronic device and a heat dissipation device thereof. The electronic device comprises a case and a mainboard arranged in the case. The heat dissipation device is arranged on the mainboard, and a heating element and slots adjacent to the heating element are arranged on the mainboard. The heat dissipation device comprises a heat dissipation block adhered to the heating element, a heat dissipation fin, a board card and heat pipes, wherein the heat dissipation fin and the board card are fixed, and the heat pipes are connected between the heat dissipation block and the heat dissipation fin; and the board card comprises a plugging part for being plugged into the slots of the mainboard. Compared with the prior art, in the electronic device and the heat dissipation device thereof, the board card being plugged into the slots of the mainboard is utilized to reinforce the heat dissipation fin, so that the larger-size heat dissipation fin can be fixed, and thus the heat dissipation is favorable.

Description

technical field [0001] The invention relates to an electronic device and a cooling device thereof. Background technique [0002] At present, electronic equipment, such as computers, servers, etc., are generally equipped with a main board, on which several heating elements, such as central processing unit, memory, etc., are installed, and the heat dissipation of the central processing unit is carried out by installing cooling fins on the central processing unit. , The heat dissipation fins are directly installed above the CPU, and then locked on the motherboard, but if the heat dissipation fins installed in this way are too high or the size is too large, it will affect the installation stability and is not conducive to heat dissipation. Contents of the invention [0003] In view of the above, it is necessary to provide an electronic device that is more conducive to heat dissipation and a heat dissipation device thereof. [0004] A heat dissipation device is installed on a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F1/20
Inventor 谭子佳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap