Development method in semiconductor component manufacture process
A technology of manufacturing process and development method, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of reducing the cleanliness of the wafer surface and affecting the production yield of products, so as to reduce defects and improve production yield , Improve the effect of cleanliness
Active Publication Date: 2014-06-11
SEMICON MFG INT (SHANGHAI) CORP +1
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Problems solved by technology
[0016] The appearance of the above-mentioned linear residue defects will greatly reduce the cleanliness of the wafer surface, which will adversely affect the realization of subsequent processes, thereby affecting the production yield of products
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[0041] In order to make the object, technical solution and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0042] image 3 It is a schematic flow chart of the developing method in the manufacturing process of semiconductor components in the present invention. Such as image 3 As shown, in the development method in the semiconductor component manufacturing process in the present invention, mainly comprise the steps as follows:
[0043] Step 301 , the spraying device starts from the starting position, sweeps across the surface of the wafer horizontally, and evenly sprays the developing solution on the surface of the wafer through the nozzles on the spraying device.
[0044] In this step, the wafer can be placed on the rotator and rotated horizontally at a set rotation rate; while the spraying device will start from the starting position, s...
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The invention provides a development method in a semiconductor component manufacture process. The method comprises the following steps: a sprinkling apparatus horizontally scans a wafer surface from a home position and uniformly sprinkles developer on the wafer surface through a nozzle of the sprinkling apparatus; a first time of puddle is carried out; through the nozzle, the sprinkling apparatus uses a cleaning solution to carry out a first time of cleaning on the wafer surface; the sprinkling apparatus returns to the home position; the sprinkling apparatus horizontally scans the wafer surface for a second time and uniformly sprinkles the developer on the wafer surface through the nozzle; a second time of puddle is carried out; through the nozzle, the sprinkling apparatus uses the cleaning solution to carry out a second time of cleaning on the wafer surface, followed by rotation drying. Through the above method, residues on the wafer surface are prevented from causing pollution to the nozzle, a line shape residue detect is effectively reduced, and cleanliness of the wafer surface is raised.
Description
technical field [0001] The invention relates to the manufacturing technology of semiconductor components, in particular to a developing method in the manufacturing process of semiconductor components. Background technique [0002] In the manufacturing process of semiconductor components, it is often necessary to produce extremely fine-sized circuit structure patterns on the wafer substrate. In order to form the required circuit structure pattern on the substrate, generally, the photoresist can be spin-coated on the wafer substrate first, then the photoresist is exposed through the photomask placed above the wafer, and then developed (Development) process, the exposed photoresist layer is removed, and the unexposed photoresist layer is left to form the desired pattern. [0003] In the development process, the chemical reaction between the developer (Developer) and the exposed photoresist layer on the wafer surface is mainly used to remove the exposed photoresist layer and le...
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IPC IPC(8): H01L21/027H01L21/00G03F7/30
Inventor 乔辉
Owner SEMICON MFG INT (SHANGHAI) CORP