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Electronic component, manufacturing method of electronic component, spiral inductance component and manufacturing method of spiral inductance component

A technology of electronic components and spiral inductors, which is applied in the field of electronic components with openings, and can solve problems such as coil eddy current loss

Inactive Publication Date: 2012-03-14
RICHWAVE TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is currently no way to improve the eddy current loss of the coil

Method used

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  • Electronic component, manufacturing method of electronic component, spiral inductance component and manufacturing method of spiral inductance component
  • Electronic component, manufacturing method of electronic component, spiral inductance component and manufacturing method of spiral inductance component
  • Electronic component, manufacturing method of electronic component, spiral inductance component and manufacturing method of spiral inductance component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] In Example 1, the spiral conductor pattern is 2.5 turns, the width value Wm of the spiral conductor pattern is 25 μm, and the distance P between adjacent turns of the spiral conductor pattern is 3 μm, the opening has a width value S of 6 μm, and the first part The width values ​​W1a, W1b are 6.5 μm, and the width values ​​W2a, W2b of the second portion are 12.5 μm.

[0071] The quality factors of Comparative Example and Example 1 were calculated respectively, and the experimental results proved that the quality factor (Q) of Example 1 was about 25% higher than that of Comparative Example.

Embodiment 2

[0073] In Example 2, the spiral conductor pattern is 3.5 turns, wherein the width value Wm of the spiral conductor pattern is 25 μm, and the distance P between adjacent turns of the spiral conductor pattern is 2 μm, the opening has a width value S of 6 μm, and the first part The width values ​​W1a, W1b of the second part are 6.5 μm, and the width values ​​W2a, W2b of the second part are 12.5 μm.

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PUM

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Abstract

The invention provides an electronic component, a manufacturing method of the electronic component, a spiral inductance component and a manufacturing method of the spiral inductance component. The electronic component comprises a substrate and a wire pattern formed on the substrate, wherein the wire pattern is provided with an opening, and the substrate is exposed in the opening.

Description

technical field [0001] The present invention relates to an electronic component, and more particularly to an electronic component with an opening. Background technique [0002] Many digital and analog components have been successfully applied to semiconductor integrated circuits (integrated circuits, ICs). The above-mentioned components include passive components, such as resistors, capacitors, or inductors. A typical integrated circuit includes a substrate, one or more dielectric layers (or insulating layers) are formed on the substrate, and one or more metal layers are formed in and on the dielectric layer. On-chip components, such as on-chip inductors, are formed using current semiconductor process technology. [0003] A conventional spiral inductor is formed in an insulating layer above a substrate, wherein the inductor is electrically connected to an external circuit through a conductive plug, a conductive layer, and a signal input / output port. The advantage of the p...

Claims

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Application Information

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IPC IPC(8): H01L27/00H01L21/70H01L21/02
Inventor 陈家豪
Owner RICHWAVE TECH CORP