System and method for collecting light sources reflected in multiple directions
A technology that reflects light beams and thin-line light sources. It is used in optics, optomechanical equipment, optical testing flaws/defects, etc., and can solve problems such as shortage and inspection of wafers.
Active Publication Date: 2015-08-19
SEMICON TECH & INSTR
View PDF7 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, due to the current lack of technical expertise and operational know-how, existing semiconductor wafer inspection systems cannot utilize simultaneous brightfield and darkfield imaging to inspect moving wafers, although design flexibility is still maintained
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0065] The inspection of semiconductor components, such as the inspection of semiconductor wafers and chip dies, is an increasingly critical step in the manufacture or construction of semiconductor components. The increasing complexity of semiconductor wafer circuitry, coupled with increasingly higher quality standards for semiconductor wafers, has resulted in a need for increasingly improved semiconductor wafer inspection systems and methods. Considering the increasing complexity of semiconductor wafer circuits and the increasingly higher quality standards of semiconductor wafers set by the semiconductor industry, the accuracy and consistency of semiconductor wafer inspection is becoming more and more critical. In particular, the accuracy and consistency of identification of defects occurring on semiconductor wafers is becoming increasingly important.
[0066] The present invention relates to a system, apparatus, apparatus, method, process, and technique for detecting devices...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| wavelength | aaaaa | aaaaa |
Login to View More
Abstract
An optical inspection system in accordance with the disclosure can be configured to simultaneously capture illumination reflected in multiple directions from the surface of a substrate, thereby overcoming inaccurate or incomplete characterization of substrate surface aspects as a result of reflected intensity variations that can arise when illumination is captured only from a single direction. Such a system includes a set of illuminators and an image capture device configured to simultaneously capture at least two beams of illumination that are reflected off the surface. The at least two beams of illumination that are simultaneously captured by the image capture device have different angular separations between their reflected paths of travel. The set of illuminators can include a set of thin line illuminators positioned and configured to supply one or more beams of thin line illumination incident to the surface. For instance, two beams of thin line illumination can be directed to the surface at different angles of incidence to a normal axis of the surface.
Description
technical field [0001] The present invention generally relates to a wafer inspection method. More specifically, the present invention relates to an automated system and method for inspecting semiconductor components. Background technique [0002] It is becoming increasingly important in the semiconductor industry to be able to consistently ensure the high quality of manufactured semiconductor components, such as semiconductor wafers and chips. Semiconductor wafer fabrication techniques continue to improve to pack more and more functions into ever smaller surface areas of semiconductor wafers. Consequently, photolithographic processes for semiconductor wafers have become more complex to include more and more functionality within a smaller surface area of the semiconductor wafer (eg, higher performance of the semiconductor wafer). Therefore, the size of latent defects of semiconductor wafers is usually in the micron to sub-micron range. [0003] It is obvious that semicon...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67G01N21/95
CPCG01N2021/8825G01N21/9501G01N2021/8845G03F7/7065
Inventor 阿曼努拉·阿杰亚拉里
Owner SEMICON TECH & INSTR