Method for adhering protection tape

Abstract

The invention provides a protective tape pasting method and a protective tape used in the protective tape pasting method. It is an object of the present invention to suppress warpage occurring in a semiconductor wafer that has undergone a backgrinding process by improving a method for attaching a protective tape. The protective tape (T) is supplied to the semiconductor wafer (W) sucked and held on the chuck table, and the intermediate sheet (TS) is supplied along the upper side of the protective tape (T), so that the intermediate sheet (TS) can be In the state where the front side of the substrate with the protective tape (T) is moved between the sticking member and the protective tape (T), the sticking member and the semiconductor wafer are moved horizontally relative to each other, so that the protective tape (T) is pasted on the semiconductor wafer. on the front side of the circle (W).

Description

technical field [0001] The present invention relates to a protective tape sticking method for sticking a protective tape on a semiconductor wafer subjected to a circuit pattern forming process. Background technique [0002] Semiconductor wafers (hereinafter, simply referred to as “wafers”) are processed as follows. The wafer forms multiple components on its front side. In the backgrinding process, the backside of the wafer is ground. In a subsequent dicing process, the wafer is diced into individual components. In recent years, with the requirement of high-density mounting, the wafer thickness tends to be reduced from 100 μm to 50 μm, or even below 50 μm. [0003] When the wafer is thinned in the back grinding process, in order to protect the front side of the wafer on which the circuit pattern is formed, to protect the wafer from the grinding stress in the back grinding process, and to strengthen the thin Thinned wafers are attached with a protective tape on their fron...

AI Technical Summary

Problems solved by technology

In this way, there is the following problem: when the wafer is subjected to backgrinding in the state where the shrinkage stress is accumulated on the protective tape, the wafer whose rigidity has been reduced due to thinning will be held by the protective tape under the contraction force of the protective tape. Warpage in the form of a concave on the bonding side (wafer front side)

[0008] After the back grinding process, the wafer with the protective tape is transported in a manner of absorbing the front side of the wafer in various subsequent processing steps, so there are also The following problems: When the wafer is concaved toward the front side and warped greatly, poor adsorption occurs, or even transportation errors occur, or the wafer falls or is damaged during transportation.

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