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Multi-chip package structure by using constant voltage power supply

A technology of power supply and packaging structure, which is applied in the direction of electric light source, electric solid device, circuit, etc., and can solve the problems of fragile, difficult to recycle, fast decay of electric light, etc.

Inactive Publication Date: 2012-05-23
PARAGON SEMICON LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, most of these lamps have disadvantages such as fast light decay, high power consumption, high heat generation, short life, fragile or difficult to recycle.

Method used

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  • Multi-chip package structure by using constant voltage power supply
  • Multi-chip package structure by using constant voltage power supply
  • Multi-chip package structure by using constant voltage power supply

Examples

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no. 1 example

[0068] see Figure 1A to Figure 1D as shown, Figure 1A is a three-dimensional schematic diagram, Figure 1B is a side view schematic diagram, Figure 1C for top view, Figure 1D is a functional block diagram. As can be seen from the above figures, the first embodiment of the present invention provides a polycrystalline packaging structure Z using a constant voltage power supply S, which includes: a substrate unit 1, a light emitting unit 2, a current limiting unit C, and a frame Unit 3 and a packaging unit 4 .

[0069] Wherein, the substrate unit 1 has a substrate body 10 , a first crystal mounting area 11 on the upper surface of the substrate body 10 , and a second crystal mounting area 12 on the upper surface of the substrate body 10 . For example, the substrate body 10 may have a circuit substrate 100, a heat dissipation layer 101 disposed on the bottom of the circuit substrate 100, a plurality of conductive pads 102 disposed on the upper surface of the circuit substra...

no. 2 example

[0077] see Figure 2A and Figure 2B as shown, Figure 2A is a three-dimensional schematic diagram, Figure 2B A schematic diagram of a side view. As can be seen from the above figures, the second embodiment of the present invention provides a polycrystalline packaging structure Z using a constant voltage power supply (not shown), which includes: a substrate unit 1, a light emitting unit 2, and a current limiting unit C. A frame unit 3 and a packaging unit 4 . Depend on Figure 2A and Figure 1A (or Figure 2B and Figure 1B ) comparison, it can be seen that the biggest difference between the second embodiment of the present invention and the first embodiment is that the substrate unit 1 of the second embodiment can omit the fabrication of the thermal insulation slit 13 . For example, when the current limiting unit C does not generate too much heat, the solution of the second embodiment of the present invention can be considered.

no. 3 example

[0079] see image 3 As shown, it is a top view. As can be seen from the above figures, the third embodiment of the present invention provides a polycrystalline packaging structure Z using a constant voltage power supply (not shown), which includes: a substrate unit 1, a light emitting unit 2, and a current limiting unit C. A frame unit 3 and a packaging unit 4 . Depend on image 3 and Figure 1C The comparison shows that the biggest difference between the third embodiment of the present invention and the first embodiment is that the current limiting unit C is located between the first surrounding frame colloid 30 and the second surrounding frame colloid 31, and the second surrounding frame colloid 31 Surrounding the first surrounding frame compound 30 , the second encapsulating compound 41 surrounds the first encapsulating compound 40 , and the first surrounding frame compound 30 and the second encapsulating compound 41 are connected to each other. In other words, the firs...

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Abstract

The invention provides a multi-chip package structure by using a constant voltage power supply. The multi-chip package structure comprises a substrate unit, an illumination unit, a current limit unit, a frame unit and an encapsulation unit, wherein the substrate unit is provided with a first crystal placement area and a second crystal placement area; the illumination unit is provided with a plurality of light emitting diode chips which are electrically arranged on the first crystal placement area; the current limit unit is provided with at least one current limit chip which is electrically arranged on the second crystal placement area and electrically connected to the illumination unit; the frame unit is provided with a first encircling frame colloid which encircles the plurality of light emitting diode chips and a second encircling frame colloid which encircles the current limit chip; and the encapsulation unit is provided with a first capsulation colloid which is encircled by the first encircling frame colloid and is used for covering the plurality of light emitting diode chips and a second capsulation colloid which is encircled by the second encircling frame colloid and is used for covering the current limit chip. According to the multi-chip package structure, the illumination efficiency of the light emitting diode chips can be improved.

Description

technical field [0001] The invention relates to a polycrystalline packaging structure, especially a polycrystalline packaging structure using a constant voltage power supply. Background technique [0002] The invention of electric light can be said to have completely changed the way of life of all human beings. If we live without electric light, all work will stop at night or when the weather is bad; The way of construction or the way of life of human beings will be completely changed, and all human beings will not be able to progress because of this, and will continue to stay in a relatively backward age. Therefore, the lighting equipment used in the market today, such as fluorescent lamps, tungsten lamps, and even the energy-saving light bulbs that are widely accepted by the public, have been widely used in daily life. However, most of these lamps have disadvantages such as fast light decay, high power consumption, high heat generation, short life, fragile or difficult to...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V19/00F21V23/06H01L25/075H01L33/48H01L33/52H01L33/62F21Y101/02
CPCH01L2224/48091H01L2924/00014
Inventor 钟嘉珽戴世能
Owner PARAGON SEMICON LIGHTING TECH
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