Temperature change testing device

Abstract

The invention discloses a temperature change testing device, which comprises a control processing unit, a programmable power supply, a semiconductor refrigerating module and a probe, wherein the control processing unit outputs current control information to the programmable power supply according to set temperature parameters; the programmable power supply controls the volume and the direction of the current which flows through the semiconductor refrigerating module according to the current control information; the semiconductor refrigerating module performs refrigerating or heating on a temperature producing face based on the output current of the programmable power supply; and the probe is connected with the temperature producing face of the semiconductor refrigerating module in order to transmit the temperature from the temperature producing face to an tested device. The temperature change testing device provided by the embodiment of the invention performs refrigerating and heating based on a semiconductor refrigerating technology, and is capable of automatically changing the temperature according to set temperature parameters, as well as carrying out the temperature change test to the whole or partial region of the tested device.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a temperature change test device based on semiconductor refrigeration technology. Background technique [0002] When doing reliability tests on electronic systems, or high and low temperature environmental tests on semiconductor devices, it is often necessary to control the working environment temperature of the device under test. Especially in the failure analysis test of electronic systems, it is necessary to isolate the devices in different areas on the circuit board, conduct temperature change analysis on key devices in local areas, and find out the specific devices that cause the system to fail in low temperature or high temperature environments. [0003] The existing large-scale temperature test chamber (referred to as large-scale temperature chamber) can control the temperature change according to the set temperature curve, and the entire electronic system can be put i...

AI Technical Summary

Problems solved by technology

However, the method of using liquid nitrogen to refrigerate can only do low-temperature tests on devices, not high-temperature tests, and liquid nitrogen is a one-time expensive consumable, which cannot meet the needs of long-term temperature change tests

The method of using a heat gun to heat the air can only be used for high-temperature tests on devices, not low-temperature tests.

Moreover, these two methods are difficult to control temperature changes, and automatic temperature changes cannot be implemented according to the set temperature curve.

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