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Memory array and associated manufacturing method

A memory and memory cell technology, applied in the field of memory arrays and related manufacturing

Active Publication Date: 2016-05-11
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the two memory cells may not be individually addressed or accessed

Method used

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  • Memory array and associated manufacturing method
  • Memory array and associated manufacturing method
  • Memory array and associated manufacturing method

Examples

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Embodiment Construction

[0014] Several embodiments of the present technology are described below with reference to memory arrays and associated fabrication methods. Numerous details of certain embodiments are described below with reference to semiconductor substrates. Throughout, the term "semiconductor substrate" is used to include various articles, for example, including individual integrated circuit dies, sensor dies, and / or dies having other semiconductor features. A memory array may be formed on a wafer or a portion of a wafer using several of the processes described below. The wafer or wafer portion (eg, in wafer form) may comprise a non-singulated wafer or wafer portion or a repopulated carrier wafer. The refilled carrier wafer may include singulated elements (eg, dies) surrounded by an adhesive material (eg, flexible adhesive) and a generally rigid frame. Numerous specific details of certain embodiments are set forth in Figures 1 through 8F and below to provide a thorough understanding of t...

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Abstract

Memory arrays and associated fabrication methods are disclosed herein. In one embodiment, a memory array includes access lines extending in a first direction and first and second contact lines extending in a second direction different from the first direction. The first and second contact lines are generally parallel to each other. The memory array also includes a memory node including a first memory cell electrically connected between the access line and the first contact line to form a first circuit, and electrically connected to the access line line and the second contact line to form a second memory cell of a second circuit different from the first circuit.

Description

technical field [0001] The present technology is generally directed to memory arrays and associated fabrication methods. Background technique [0002] Memory cells, such as floating gate transistors or PCRAM cells, are typically arranged in an array connected to a grid formed of a plurality of word and bit lines. The word lines are generally parallel to each other and perpendicular to the bit lines. Each of the memory cells forms a node of the array, and each node is connected to a particular pair of word and bit lines. In operation, each memory cell can be accessed individually by energizing a particular pair of word and bit lines while floating or oppositely biasing the remaining word and bit lines. [0003] However, conventional arrangements of such memory arrays cannot accommodate more than one memory cell per node. If the memory array includes two memory cells per node that are connected to a pair of word lines and bit lines, then energizing the pair of word lines an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C5/02G11C7/12G11C8/08G11C7/18G11C8/14
CPCG11C5/063G11C13/0004G11C13/0023H10B63/20H10B63/80H10N70/8265H10N70/231H10N70/068G11C5/02G11C7/18G11C8/14H10B63/00H10N70/882
Inventor 刘峻
Owner MICRON TECH INC
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