Memory array and associated manufacturing method
A memory and memory cell technology, applied in the field of memory arrays and related manufacturing
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[0014] Several embodiments of the present technology are described below with reference to memory arrays and associated fabrication methods. Numerous details of certain embodiments are described below with reference to semiconductor substrates. Throughout, the term "semiconductor substrate" is used to include various articles, for example, including individual integrated circuit dies, sensor dies, and / or dies having other semiconductor features. A memory array may be formed on a wafer or a portion of a wafer using several of the processes described below. The wafer or wafer portion (eg, in wafer form) may comprise a non-singulated wafer or wafer portion or a repopulated carrier wafer. The refilled carrier wafer may include singulated elements (eg, dies) surrounded by an adhesive material (eg, flexible adhesive) and a generally rigid frame. Numerous specific details of certain embodiments are set forth in Figures 1 through 8F and below to provide a thorough understanding of t...
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