Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board with BGA area

A technology of circuit boards and areas, applied in the direction of circuit devices, printed circuits, printed circuits, etc., can solve the problems of impedance mismatch, affecting the quality of signal transmission, and the impedance of signal lines cannot be consistent, etc.

Inactive Publication Date: 2012-09-26
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the connection between the signal line and the BGA (Ball Grand Assay, ball grid array), the impedance of the signal line is usually not consistent with the impedance of other positions, resulting in the problem of impedance mismatch and affecting the quality of signal transmission

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board with BGA area
  • Circuit board with BGA area
  • Circuit board with BGA area

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0016] Please refer to figure 1 , figure 2 , Which discloses the circuit board 10 of the first embodiment of the present invention, wherein: image 3 Is a schematic cross-sectional view of the circuit board 10 in the non-BGA area, Figure 4 It is a schematic cross-sectional view of the circuit board 10 in the BGA area.

[0017] The circuit board 10 includes a signal wiring layer 20 and a dielectric layer 30 adjacent to the signal wiring layer 20. In practical applications, the circuit board 10 is a multilayer circuit board, which can be 4 layers, 6 layers, 8 layers, or more according to actual needs. For simplicity, in the drawings, only the signal wiring layer 20 and the dielectric layer 30 related to the present invention are shown.

[0018] The dielectric layer 30 is used to fix the signal wiring layer 20 and isolate the signal wiring layer 20 from other conduc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a circuit board, comprising a signal routing layer and a dielectric layer for fixing the signal routing layer. The signal routing layer comprises signal wires and a BGA area and a non-BGA area connected with the signal wires, wherein a connecting width of the signal wires and the BGA area is smaller than that of the signal wires and the non-BGA area. The dielectric coefficient of the dielectric layer in the BGA area is greater than that in the non-BGA so that impedance of the signal wires can be kept consistent along entire length.

Description

Technical field [0001] The invention relates to a circuit board with a BGA area. Background technique [0002] The impedance of the signal line on the circuit board is determined by the size of the signal line and the characteristics of the dielectric layer on which the signal line is attached. At the connection point between the signal line and the BGA (Ball Grand Assay, ball grid array), the impedance of the signal line is usually not consistent with the impedance of other positions, which causes the problem of impedance mismatch and affects the quality of signal transmission. Summary of the invention [0003] In view of this, it is necessary to provide a circuit board with a BGA area, and the impedance of the signal line of the circuit board is consistent between the BGA area and the non-BGA area. [0004] A circuit board includes a signal wiring layer and a dielectric layer for fixing the signal wiring layer. The signal wiring layer includes a signal line and a BGA area and a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11
CPCH05K1/025H05K1/024H05K1/0245H05K2201/09727
Inventor 周华丽白家南许寿国
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com