Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member
A technology for sealing parts and electronic devices, which is applied in the direction of semiconductor/solid-state device parts, electric solid-state devices, electrical components, etc., and can solve the problem that the through hole cannot be completely sealed, it is difficult to fill the through hole, and the inner space of the package is airtight Sexual decline and other issues
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Embodiment approach 1
[0161] figure 1 It is a schematic sectional view showing the internal space of the crystal unit according to the first embodiment. in addition, Figure 2A ~ Figure 2C It is a schematic diagram which shows the schematic structure of the base concerning Embodiment 1. in, Figure 2A is a schematic top view; Figure 2B is along Figure 2A A schematic cross-sectional view of the cross-sectional state after the dotted line in cuts off the base; Figure 2C It is a schematic bottom view.
[0162] in addition, Figure 3A and Figure 3B It is a schematic diagram which shows the schematic structure of the cap concerning Embodiment 1. in, Figure 3A is a schematic sectional view; Figure 3B It is a schematic bottom view. in addition, Figure 4 It is a schematic bottom view of the crystal vibrating piece according to Embodiment 1.
[0163] Such as figure 1 As shown, in the crystal resonator 1 related to the first embodiment, a crystal vibrating piece 2 (the electronic device ...
Embodiment approach 2
[0215] The configuration of the crystal unit 1 according to the second embodiment is basically the same as that of the crystal unit 1 according to the first embodiment. Therefore, only points different from the crystal unit 1 according to the first embodiment will be described below.
[0216] The configuration of the base 4 of the crystal unit 1 according to the second embodiment is different from the configuration of the base 4 of the crystal unit 1 according to the first embodiment.
[0217] Figure 24A ~ Figure 24C It is a schematic diagram showing the schematic structure of the base 4 according to the second embodiment, Figure 24A is a schematic top view, Figure 24B is along Figure 24A A schematic cross-sectional view of the state of the cut surface after the dotted line cuts the base 4, Figure 24C It is a schematic bottom view.
[0218] In the base 4 of the crystal resonator 1 according to Embodiment 2, on the rear surface (the other main surface 43 ) of the case...
Embodiment approach 3
[0226] The crystal unit 1 according to the third embodiment has basically the same structure as that of the crystal unit 1 according to the first embodiment, and therefore can produce the same effects as those of the crystal unit 1 according to the first embodiment. Hereinafter, only the parts different from the crystal unit 1 according to the first embodiment will be described.
[0227] The configuration of the base 4 of the crystal unit 1 according to the third embodiment is different from the configuration of the base 4 of the crystal unit 1 according to the first embodiment.
[0228] Figure 25A ~ Figure 25C It is a schematic diagram showing the schematic structure of the base 4 according to the third embodiment, Figure 25A is a schematic top view, Figure 25B is along Figure 25A A schematic cross-sectional view of the state of the cut surface after the dotted line cuts the base 4, Figure 25C It is a schematic bottom view.
[0229] In the base 4 of the crystal reso...
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