Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member

A technology for sealing parts and electronic devices, which is applied in the direction of semiconductor/solid-state device parts, electric solid-state devices, electrical components, etc. Sexual decline, etc.

Inactive Publication Date: 2012-10-03
DAISHINKU CORP
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, conductive pastes such as the silver paste disclosed in Patent Document 1 generally have high viscosity, so it is difficult to fill tiny via holes
In addition, when a metal member is used as a conductive member to fill a minute through hole, it is difficult to manufacture a minute metal member that can be closely bonded to the minute through hole.
[0008] For this reason, when filling tiny via holes with conductive paste or metal components, poor filling may occur
Due to such poor filling, the through hole cannot be completely sealed, and as a result, the airtightness of the internal space of the package is lowered.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member
  • Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member
  • Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0103] figure 1 It is a schematic sectional view showing the internal space of the crystal unit according to the first embodiment. in addition, Figure 2A ~ Figure 2C It is a schematic diagram which shows the schematic structure of the base concerning Embodiment 1. in, Figure 2A is a schematic top view; Figure 2B is along Figure 2A A schematic cross-sectional view of the cross-sectional state after the dotted line in cuts off the base; Figure 2C It is a schematic bottom view.

[0104] in addition, Figure 3A and Figure 3B It is a schematic diagram which shows the schematic structure of the cap concerning Embodiment 1. in, Figure 3A is a schematic sectional view; Figure 3B It is a schematic bottom view. in addition, Figure 4 It is a schematic bottom view of the crystal vibrating piece according to Embodiment 1.

[0105] like figure 1 As shown, in the crystal resonator 1 related to the first embodiment, a crystal vibrating piece 2 (the electronic device eleme...

Embodiment approach 2

[0157] The configuration of the crystal unit 1 according to the second embodiment is basically the same as that of the crystal unit 1 according to the first embodiment. Therefore, only points different from the crystal unit 1 according to the first embodiment will be described below.

[0158] The configuration of the base 4 of the crystal unit 1 according to the second embodiment is different from the configuration of the base 4 of the crystal unit 1 according to the first embodiment.

[0159] Figure 24A ~ Figure 24C It is a schematic diagram showing the schematic structure of the base 4 according to the second embodiment, Figure 24A is a schematic top view, Figure 24B is along Figure 24A A schematic cross-sectional view of the state of the cut surface after the dotted line cuts the base 4, Figure 24C It is a schematic bottom view.

[0160] In the base 4 of the crystal resonator 1 according to Embodiment 2, on the rear surface (the other main surface 43 ) of the case...

Embodiment approach 3

[0168] The crystal unit 1 according to the third embodiment has basically the same structure as that of the crystal unit 1 according to the first embodiment, and therefore can produce the same effects as those of the crystal unit 1 according to the first embodiment. Hereinafter, only the parts different from the crystal unit 1 according to the first embodiment will be described.

[0169] The configuration of the base 4 of the crystal unit 1 according to the third embodiment is different from the configuration of the base 4 of the crystal unit 1 according to the first embodiment.

[0170] Figure 25A ~ Figure 25C It is a schematic diagram showing the schematic structure of the base 4 according to the third embodiment, Figure 25A is a schematic top view, Figure 25B is along Figure 25A A schematic cross-sectional view of the state of the cut surface after the dotted line cuts the base 4, Figure 25C It is a schematic bottom view.

[0171] In the base 4 of the crystal reso...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is an electronic component package, wherein a stable conduction state is ensured at a penetration hole provided in a sealing member, and the inside of the electronic component package can be sufficiently sealed. An electronic component package comprises: a first sealing member (electronic component package sealing member) (4) and a second sealing member (6) which are disposed facing each other and hermetically seal electrodes (31, 32) of an electronic component element (2); an inner electrode (55) which is formed on a surface (42) that is on a base of the first sealing member (4) and faces the second sealing member (6), and an outer electrode (56) which is formed on a surface (43) that is on the base of the first sealing member (4) and faces the surface (42); a penetration hole (49) which penetrates the base of the first sealing member (4); and a penetration electrode (57) which is formed inside the penetration hole (49) through which the inner electrode (55) and the outer electrode (56) are electrically connected. At least one open surface of the penetration hole (49) is sealed by a resin material (58).

Description

technical field [0001] The present invention relates to a sealing member for an electronic device package, an electronic device package using the sealing member for an electronic device package, and a method for manufacturing the sealing member for an electronic device package. The sealing member is used as the first sealing member of an electronic device package in which the electrodes of the electronic device element are sealed by the first sealing member and the second sealing member arranged to face each other. Background technique [0002] The internal space of the electronic device package is hermetically sealed to prevent deterioration of the characteristics of the electrodes of the electronic device components mounted in the internal space. As an electronic device package in which such an internal space is hermetically sealed, there is, for example, a piezoelectric vibration device such as a crystal resonator. [0003] As such an electronic device package, there is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H01L23/02H03H3/02
CPCH03H9/0514H01L23/3107H03H9/0547H03H9/1021H01L2924/0002H01L2924/00Y10T29/42
Inventor 幸田直树
Owner DAISHINKU CORP