Audio interface structure and electronic apparatus using the same

A technology of interface structure and electronic device, applied in the direction of electrical components, transducer circuit, transducer shell/cabinet/support, etc., can solve the problem of inconsistent height between audio unit and printed circuit board

Inactive Publication Date: 2012-10-17
INVENTEC CORP
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, when the distance between the intended location of the audio unit and the printed circuit board is too long, or the height of the intended design of the audio uni

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Audio interface structure and electronic apparatus using the same
  • Audio interface structure and electronic apparatus using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0025] Please refer to figure 1 , which shows a schematic diagram of the interior of the electronic device according to an embodiment of the present invention. The electronic device 10 can be, for example, a notebook computer, a tablet computer or a mobile phone. The electronic device 10 includes an audio interface structure 100 and a host body 200 . The audio interface structure 100 is electrically connected to the host body 200 . The host body 200 can, for example, generate an audio signal, which can be transmitted to the audio interface structure 100, and then the audio signal can be transmitted to the outside or other equipment through the audio interface structure 100, for example, transmitted to the earphone so that the user can hear it through the earphone this source signal.

[0026] Please continue to refer to fi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an audio interface structure and an electronic apparatus using the same. The audio interface structure comprises a flexible printed circuit (FPC) and an audio unit, wherein the audio unit that is used to transmit a sound source signal to the external world is arranged on the FPC and electrically connected with the FPC. In addition, the invention also puts forward an electronic apparatus. The electronic apparatus comprises an audio interface structure and a host main body; the audio interface structure includes an FPC and an audio unit that is used for transmitting a sound source signal to the external world and is arranged on the FPC and electrically connected with the FPC; and the host main body includes a connector that is electrically connected to the FPC.

Description

technical field [0001] The invention relates to an audio interface structure and an electronic device using the structure, and in particular to an audio interface structure with high flexibility in the setting position of the audio unit and an electronic device using the structure. Background technique [0002] Conventionally, since the audio unit is directly disposed on a rigid printed circuit board, such as a dual in line package (DIP), the available position of the audio unit is limited to the periphery of the printed circuit board. In this way, if the desired position of the audio unit cannot match the position of the printed circuit board, either the position of the printed circuit board or the position of the audio unit needs to be redesigned. For example, when the distance between the intended location of the audio unit and the printed circuit board is too long, or the height of the intended design of the audio unit and the printed circuit board in the structure is in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H04R3/00H04R1/02
Inventor 廖建中王国睿吴文宏
Owner INVENTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap