Unlock instant, AI-driven research and patent intelligence for your innovation.

Method of vertically mounting an integrated circuit

A technology of integrated circuits and circuit boards, applied in circuits, measuring devices, electrical components, etc., can solve the problems of increasing the physical size of devices and manufacturing complexity

Inactive Publication Date: 2012-10-31
EVERSPIN TECHNOLOGIES
View PDF8 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this vertical mounting increases the physical size and manufacturing complexity of the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of vertically mounting an integrated circuit
  • Method of vertically mounting an integrated circuit
  • Method of vertically mounting an integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following detailed description is merely exemplary in nature and is not intended to limit the invention or the application and uses of the invention. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the following detailed description.

[0021] In a first exemplary embodiment taught herein, a first integrated circuit, such as a magnetic tunnel junction (MTJ) sensor exhibiting tunneling magnetoresistance, is cut to expose at least one conductor coupled to circuitry of the first integrated circuit. side of the pad. The first integrated circuit is then vertically mounted on the circuit board or the second integrated circuit such that the at least one exposed conductive pad of the first integrated circuit contacts at least one contact point on the circuit board or the second integrated circuit. Solder bumps are placed on conductive pads or contacts prior to mounting...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method of mounting a first integrated circuit (102, 500, 704) on a circuit board (300, 700) or a second integrated circuit (706), the first Integrated circuit (102, 500, 704) formed over a substrate (104) and having a surface (119) opposed to the substrate (104) and a side (122, 530, 930) substantially orthogonal to the surface (119), and Including a conductive element (116, 117, 118, 522, 524, 526, 528, 528', 528") coupled to circuitry (102, 500, 704) and lormed within a dielectric material (120, 518), the circuit board or the second integrated circuit including a contact point (304, 306, 314), the method including singulating (1104) the first Integrated circuit to expose the conductive element (116,117,118,522,524,526,528,52ss',528') on the side (222,630, 1030), and mounting (1108); the first integrated circuit on a circuit board or a second integrated circuit by aligning the conductive element exposed on the side to make electrical contact.

Description

technical field [0001] The present invention relates generally to integrated circuit packaging methods and structures, and more particularly to methods of vertically mounting integrated circuits such as thin film magnetic field sensors. Background technique [0002] Many integrated circuit mounting methods have evolved over time, including, to name a few, for dual in-line packages (DIP), pin grid arrays (PGA), ball grid arrays (BGA), leadless chip mount (LCC) and Small Outline Integrated Circuit (SOIC) mounting methods. Packaging the integrated circuit helps mount the integrated circuit on a circuit board, electrically isolate it from other integrated circuits, and protect the integrated circuit from exposure to the environment. The integrated circuit includes a plurality of electrical contact pads that are coupled to leads on the circuit board, such as by wires soldered between the electrical contact pads and the leads on the circuit board. Integrated circuits are usually...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H10N39/00
CPCG01R33/093H01L24/03H01L2924/01082H01L24/06H01L2924/01047H01L2924/01079H01L2924/01045H01L2924/14H01L2924/01076H01L2924/01033H01L2924/01005H01L2924/01044H01L2924/01029H01L2224/0401H01L2924/01078H01L2924/01027H01L2924/01014B82Y25/00H01L2924/01073H01L2924/01075H01L2924/014H01L2924/01013G01R33/098H01L27/22H01L2924/01024H01L2224/05554H10B61/00H10N59/00
Inventor J·斯劳特P·马瑟
Owner EVERSPIN TECHNOLOGIES