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Testing method for testing solid-solid contact thermal resistance by using forward and reverse bidirectional heat flux method

A technology of contact thermal resistance and test method, applied in the field of testing, can solve the problems of measurement accuracy of difficult interface contact thermal resistance, temperature measurement uncertainty error, etc.

Active Publication Date: 2012-11-07
NANJING UNIV OF SCI & TECH
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Problems solved by technology

Most of the steady-state contact thermal resistance test methods are similar to the test standard equipment of the American National Standard ASTM D5470-06, but many documents point out that it is difficult to guarantee the interface thermal contact resistance due to the uncertainty error of temperature measurement and the error of heat loss. High enough measurement accuracy

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  • Testing method for testing solid-solid contact thermal resistance by using forward and reverse bidirectional heat flux method
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  • Testing method for testing solid-solid contact thermal resistance by using forward and reverse bidirectional heat flux method

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Embodiment Construction

[0048] Therefore, in order to solve the above problems, the present invention proposes a method for measuring solid-solid contact thermal resistance by a positive and negative bidirectional heat flow method on the basis of American National Standards ASTM E1225 and ASTM D5470. The symmetrical structure test structure can basically eliminate the uncertainty error of temperature measurement due to the different contact conditions between the multiple temperature sensors arranged on the test piece and the test piece, thereby improving the test accuracy. Combining the temperature-controllable thermal radiation shield and auxiliary measures to reduce the loss of lateral heat flow, and adopting an optimized minimum test heat flow to ensure the one-dimensionality of the temperature gradient of the test material to achieve high-precision test thermal properties of the specimen For the purpose of parameters, this method can measure the interface thermal resistance between the same mater...

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Abstract

The invention provides a testing method for testing solid-solid contact thermal resistance by using a forward and reverse bidirectional heat flux method on the basis of American national standards ASTME (American society of tool and manufacturing engineers) 1225 and ASTM (American society for testing and materials) D5470. The testing method includes that a vertical bidirectional heat flux symmetric testing structure is adopted, accordingly, uncertain temperature measurement errors caused by different contact conditions of a plurality of temperature sensors and a tested specimen can be basically eliminated, the temperature sensors are arranged on the tested specimen, and testing precision is improved. In addition, a temperature-controllable anti-radiation screen resisting thermal radiation and assisting measures are combined to reduce transverse heat flux loss, one-dimensionality of temperature gradient of a tested material is guaranteed by optimized minimum testing heat flux, so that the purpose of precisely testing thermal property parameters of the tested specimen is achieved, and the method can be used for precisely measuring contact thermal resistance of interfaces of the same type of materials or contact thermal resistance of interfaces of different types of materials.

Description

technical field [0001] The invention belongs to the technical field of testing, and in particular relates to a solid-solid contact thermal resistance test method, which is suitable for testing the interface contact thermal resistance between commonly used materials, and is especially suitable for testing the interface contact thermal resistance of solid-solid materials. Background technique [0002] Contact thermal resistance is a parameter affected by many factors such as material properties, mechanical properties, surface morphology, contact pressure, temperature, and gap material. According to whether the experimental heat flow is stable, the contact thermal resistance measurement methods are generally divided into transient method and steady state method. Transient method is also a commonly used experimental measurement method of thermal contact resistance, which mainly includes laser photothermal measurement method, thermal imaging method, "flash" flash method, laser ph...

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Application Information

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IPC IPC(8): G01N25/20
Inventor 宣益民张平李强徐德好
Owner NANJING UNIV OF SCI & TECH
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