High-accuracy method for testing thermal interface material

A technology of thermal interface material and testing method, which is applied in the field of testing, and can solve problems such as temperature measurement uncertainty error, difficult interface contact thermal resistance measurement accuracy, etc.

Active Publication Date: 2012-11-07
NANJING UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Most of the steady-state contact thermal resistance test methods are similar to the test standard equipment of the American National Standard ASTMD5470-06, but many documents point out that due to the uncertainty error of temperature measurement and heat loss error, it is difficult to ensure sufficient contact thermal resistance at the interface. high measurement accuracy

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  • High-accuracy method for testing thermal interface material
  • High-accuracy method for testing thermal interface material
  • High-accuracy method for testing thermal interface material

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Embodiment Construction

[0051] The present invention proposes a symmetrical test structure using positive and negative bi-directional heat flow on the basis of the American national standard ASTM D5470, which can basically eliminate the occurrence of different contact conditions between the multiple temperature sensors arranged on the test heat flow meter and the test heat flow meter. Uncertainty errors in temperature measurement, combined with temperature-controllable thermal radiation shields and auxiliary heating measures to reduce heat flow loss, and using an optimized minimum test heat flow to ensure the one-dimensionality of the temperature gradient of the test material, to To achieve the purpose of testing the thermophysical parameters of the thermal flowmeter with high precision, the method can measure the contact thermal resistance performance and effective equivalent thermal conductivity of the thermal interface material with high precision.

[0052] The present invention will be described i...

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Abstract

The invention discloses a high-accuracy method for testing a thermal interface material. The high-accuracy method comprises step one, preparing testing devices and selecting a test point of a testing thermal flow meter; step two, loading pressure stress and heating the thermal flow meter in a forward direction; step three, collecting the temperature of the test point and calculating forward contact thermal resistance R'; step four, loading pressure stress and reversely loading heat flux and collecting temperature of the test point; step five, calculating reverse contact thermal resistance R''; step six, calculating contact thermal resistance of the thermal interface material; and step seven, measuring the thickness L of the thermal interface material and calculating equivalent heat conductivity of the thermal interface material. According to the method, a symmetrical test structure capable of achieving vertical two-way heat flux is utilized to perform measurement, so that uncertainty errors of temperature measurement caused by a plurality of temperature sensors distributed on the testing thermal flow meter and different contact conditions of the testing thermal flow meter are basically eliminated, and then the contact resistance and effective equivalent heat conductivity of the thermal interface material can be measured in high accuracy mode under the premise that the heat flux accuracy is ensured.

Description

technical field [0001] The invention belongs to the technical field of testing, and in particular relates to a contact thermal resistance test method, which is suitable for testing the interface thermal resistance of commonly used materials, especially for performance testing of thermal interface materials. Background technique [0002] Contact thermal resistance is a parameter affected by many factors such as material properties, mechanical properties, surface morphology, contact pressure, temperature, and gap material. According to whether the experimental heat flow is stable, the contact thermal resistance measurement methods are generally divided into transient method and steady state method. Transient method is also a commonly used experimental measurement method of thermal contact resistance, which mainly includes laser photothermal measurement method, thermal imaging method, "flash" flash method, laser photoacoustic method, etc., and laser photothermal measurement met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
Inventor 宣益民张平李强徐德好
Owner NANJING UNIV OF SCI & TECH
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