Flexible circuit board heating and bending mechanism
A flexible circuit board and bending mechanism technology, which is applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of waste of manpower, material resources, difficult to complete flexible boards, and high production costs, and achieve high safety performance. Realize the effect of automatic bending and high machining accuracy
Active Publication Date: 2017-07-07
JIANGSU LEADER ELECTRONICS INFORMATION TECH
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Problems solved by technology
[0003] At present, the bending and other processing and production in the production of flexible circuit boards are mostly done manually, which is inefficient, wastes manpower and material resources, and has high production costs. Moreover, most of the flexible circuit board forming and bending are difficult to complete, and the springback is very strong.
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Embodiment Construction
[0019] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0020] Such as Figure 1~4 Shown, the present invention comprises lower formwork 7, the linear guide rail that is fixed on the lower formwork 7, the first contour block 13 and the second contour block 16 that are located on the slide block, what link to each other is upper formwork 6, upper formwork 6 There is a cylinder 1 on the rear side, and a lower mold cylinder 8 is connected to the lower template 7, which is connected to the upper template 6 through a "T" connector 17. There are four contour columns 5 on the upper template 6, and the cylinders are connected to it. The fixed plate 4 and the upper mold module 14 can move up and down in the cavity of the upper template 6, which reduces the impact of the movement. The lower template 7 is provided with a heating module 11, which can move back and forth to complete heating and bending. It also ...
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The invention discloses a flexible circuit board heating and bending mechanism, which comprises a lower template, a linear guide rail fixed on the lower template, a first equal-height block and a second equal-height block arranged on the slider, and connected with the On the upper formwork, there is a cylinder on the rear side of the upper formwork, and the lower formwork is connected to the lower mold cylinder, which is connected to the upper formwork through a "T" connector. There are four contour columns on the upper formwork, and the cylinder fixing plate is connected to it. The upper mold module can move up and down in the cavity of the upper mold plate, which reduces the impact of the movement. The lower mold plate is equipped with a heating module, which can move back and forth to complete heating and bending. It also includes a core, and a blowing hole is provided under the core. The invention has the advantages of convenient installation, small volume, high processing precision, stability, cheap price, etc., is suitable for processing flexible circuit boards, and realizes the bending automation of flexible circuit boards.
Description
technical field [0001] The invention relates to a bending mechanism, in particular to a heating and bending mechanism for a flexible circuit board. Background technique [0002] Flexible circuit board, also known as flexible circuit board or flexible board, is a kind of highly reliable, excellent Flexible printed circuits. This kind of circuit board can be bent and folded at will, light in weight, small in size, good in heat dissipation, easy to install, and breaks through the traditional concept of interconnection technology. At present, flexible circuit boards have been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, digital cameras and other fields. [0003] At present, the bending and other processing and production in the production of flexible circuit boards are mostly done manually, which has low efficiency, wastes manpower and material resources, and high production costs. Contents of the invention [0004] The ...
Claims
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IPC IPC(8): H05K3/00
Inventor 陈小波
Owner JIANGSU LEADER ELECTRONICS INFORMATION TECH