Method for determining amount of ball placement for camera module

Abstract

The invention discloses a method for determining amount of ball placement for a camera module. The camera module comprises a substrate and a chip. The substrate is provided with an opening and a plurality of contacts. The opening of the substrate is provided with a square frame. An image acquisition device is used to acquire distances from at least four specific contacts on the substrate to the image acquisition device, a distance from the square frame of the opening to an opening of the image acquisition device, a distance from each contact on the substrate to an actual contact of the image acquisition device so as to obtain an average contact distance, a smallest opening distance and a plurality of actual contact distances. The amount of ball placement for each contact is calculated according to the distances, so that packaging quality of the camera module is improved.

Description

technical field [0001] The invention relates to a method for determining the quantity of balls to be planted, in particular to a method for determining the quantity of balls to be planted in a camera module. Background technique [0002] At present, most of the camera modules 10 are assembled by flip-chip (Flip-Chip) packaging technology, such as figure 1 as shown, figure 1 It is a schematic diagram of an existing camera module. The camera module 10 includes a substrate 11 and a chip 12, wherein the substrate 11 has a contact point 111 and an opening 112, the chip 12 has a sensing area 121 and pads 122, and each pad 122 is provided with a conductive block 13 for The contacts 111 and the pads 122 are electrically connected to fix the substrate 11 and the chip 12 . [0003] read on figure 1 , the contacts 111 are distributed around the opening 112, corresponding to the pads 122, and the opening 112 of the substrate 11 is formed by punching a hole element. However, when th...

AI Technical Summary

Problems solved by technology

Although this can prevent the raised edge 113 from forming a fulcrum with the chip 12, the heights of the contacts 111 of the substrate 11 corresponding to the pads 122 are not the same. If only the same number of conductive blocks 13 are placed on each pad 122, Not only does it increase unnecessary packaging costs, it is more likely that the chip 12 will be skewed due to the problem of uneven height of the contacts 111

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