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Microstrip lines based on metamaterials

A technology of microstrip line and metamaterial, which is applied in the field of microstrip line, can solve problems such as space wave leakage and electromagnetic wave crosstalk of microstrip line, and achieve the effects of suppressing wave leakage, solving electromagnetic wave crosstalk, and reducing electromagnetic wave crosstalk

Active Publication Date: 2015-11-04
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to overcome the defects of the spatial wave leakage of the high-order mode of the microstrip line in the prior art, and provide a microstrip line based on metamaterials, which can effectively suppress the space wave leakage and solve the problem of the gap between the microstrip lines. The problem of electromagnetic wave crosstalk

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  • Microstrip lines based on metamaterials
  • Microstrip lines based on metamaterials
  • Microstrip lines based on metamaterials

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Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0028] like image 3 As shown, the microstrip line based on the metamaterial, the microstrip line includes a metal strip 10, a dielectric substrate and a ground plane 20, and the microstrip line also includes a metamaterial film 50, and the metamaterial film 50 and the metal strip 10 It is located on one side of the dielectric substrate and is closely attached to the dielectric substrate, wherein the metamaterial thin film 50 covers the metal strip 10; the dielectric substrate is spliced ​​by the first substrate 40 and the second substrate 30 The first substrate 40 and the second substrate 30 have different refractive index distributions, and the second substrate 30 is spliced ​​on both sides of the first substrate 40, wherein the first substrate 40 is arranged directly ...

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Abstract

The invention relates to a metamaterial-based microstrip line. The microstrip line comprises a metal strip, a dielectric substrate, an earth plate and a metamaterial thin film, wherein the metamaterial thin film and the metal strip are arranged on the same side of the dielectric substrate and cling to the dielectric substrate; the metamaterial thin film covers the metal strip; the dielectric substrate is formed by splicing a first substrate and second substrates; the first substrate and the second substrates have different refractive index distribution; the second substrates are spliced on the two sides of the first substrate; the first substrate is arranged under the metal strip; and the earth plate is arranged on the other side of the dielectric substrate. The microstrip line has the beneficial effects that space wave leak can be effectively restricted and the problem of electromagnetic wave crosstalk between microstrip lines is solved.

Description

technical field [0001] The invention relates to the field of microstrip lines, more specifically, to a microstrip line based on metamaterials. Background technique [0002] Microstrip Line (Microstrip Line) is currently the most widely used planar transmission line in Hybrid Microwave Integrated Circuits (HMIC) and Monolithic Microwave Integrated Circuits (MMIC). like figure 1 As shown, from a structural point of view, the microstrip line is placed on a ground plane 2 by a very thin metal strip 1 at an interval much smaller than the wavelength, and the metal strip 1 and the ground plane 2 are separated by a dielectric substrate 3 . [0003] The outstanding advantages of microstrip lines are compact structure and light weight. Complex microwave circuits can be made in a small volume by stereolithography, photolithography, corrosion and other processes, and it is easy to integrate with other microwave devices to realize microwave components and systems. integration. [0004...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P3/08
Inventor 刘若鹏季春霖岳玉涛
Owner KUANG CHI INST OF ADVANCED TECH