Cold end and hot end separated type thermoelectric refrigeration semiconductor technology

A technology of thermoelectric refrigeration and N-type semiconductors, which is applied to thermoelectric devices that only use the Peltier or Seebeck effect, can solve the problem that the cold end and the hot end cannot be separated at a long distance, and achieve convenient forced cooling, small thermal conductivity, and Simplify the effect of insulation

Inactive Publication Date: 2013-03-27
雍占锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The purpose of the present invention is to provide a method for connecting the PN junction of thermoelectric refrigeration, which solves the problem that the cold e

Method used

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  • Cold end and hot end separated type thermoelectric refrigeration semiconductor technology
  • Cold end and hot end separated type thermoelectric refrigeration semiconductor technology
  • Cold end and hot end separated type thermoelectric refrigeration semiconductor technology

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Embodiment 1: as figure 2 As shown, the method for connecting cold-end and hot-end separated thermoelectric cooling semiconductors includes copper connecting pieces (1), N-type semiconductors (2), P-type semiconductors (3), DC power supplies (5), wires (6 ). The current from the positive pole of the DC power supply (5) is connected through the wire (6), and then passes through the copper connecting piece (1)-N-type semiconductor (2)-copper connecting piece (1)-wire (6)-copper connecting piece ( 1)-N-type semiconductor (2)-copper connection sheet (1)-P-type semiconductor (3)-copper connection sheet (1)-wire (6)-P-type semiconductor (3)-copper connection sheet (1)- Wire (6) - the negative pole of the DC power supply (5); the NNPP junction in the above series circuit absorbs heat at the NP end and releases heat at the PN end. Although this connection method is used for thermoelectric cooling, it can also be used for thermoelectric power generation when the DC power supp...

Embodiment 2

[0021] Embodiment 2: as image 3 As shown, the connection method of the thermoelectric cooling semiconductor with separated cold end and hot end includes a copper connecting piece (1), an N-type semiconductor (2), a P-type semiconductor (3), a heat-conducting ceramic piece (4), a DC power supply (5), wire (6). The current from the positive pole of the DC power supply (5) passes through the connection of the wire (6), and then passes through multiple copper connection pieces (1)-N-type semiconductor (2)-copper connection piece (1)-wire (6)-copper connection Sheet (1)-N-type semiconductor (2)-copper connection sheet (1)-P-type semiconductor (3)-copper connection sheet (1)-wire (6)-P-type semiconductor (3) in series to form an NNPP junction, Heat is absorbed at the NP end and released at the PN end, so a cold end is formed on the upper heat-conducting ceramic sheet (4), and a hot end is formed on the lower heat-conducting ceramic sheet (4). Although this connection method is us...

Embodiment 3

[0022] Embodiment 3: as Figure 4 As shown, the cold-end and hot-end separation type thermoelectric cooling semiconductor series connection method includes copper connecting piece (1), N-type semiconductor (2), P-type semiconductor (3), DC power supply (5), wire (6 ). The current from the positive pole of the DC power supply (5) is sequentially connected through wires (6), and multiple copper connection pieces (1)-P-type semiconductor (3)-copper connection piece (1)-N-type semiconductor (2)-copper connection Sheet (1)-wire (6)-copper connection sheet (1)-N-type semiconductor (2)-copper connection sheet (1)-P-type semiconductor (3)-copper connection sheet (1) in series to form a PNNP junction, Heat is absorbed at the NP side and released at the PN side. The series circuit can be easily made into electric cooling quilt, electric cooling cap, electric cooling bag, etc., the hot end is placed outside the bag (or quilt, cap) to dissipate heat, and the cold end is placed inside th...

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Abstract

The invention discloses a cold end and hot end remotely-separated type thermoelectric refrigeration semiconductor or thermoelectric power generation semiconductor and a product applying the semiconductor. Two PN junctions are connected through a lead wire in a back-to-back mode to form a PN-NP junction or an NP-PN junction, and cold ends and hot ends are separated through the lead wire. By means of the method, multiple cold ends and multiple hot ends can be collected and distributed, can coiled to form an electric refrigeration blanket, a plurality of computer chips or circuit devices can be cooled, forced cooling can be achieved by gathering the hot ends, and natural cooling can be achieved by dispersing the hot ends.

Description

technical field [0001] The invention relates to a thermoelectric refrigeration semiconductor or a thermoelectric power generation semiconductor and products using the technology. Background technique [0002] Thermoelectric coolers are composed of semiconductor PN junctions that apply the Peltier effect; N-type materials have excess electrons and have negative thermoelectric potentials, and P-type materials have insufficient electrons and have positive thermoelectric potentials; when electrons pass through the junction from P-type When it is N-type, the temperature of the junction decreases, and its energy must increase, and the increased energy is equivalent to the energy consumed by the junction. Conversely, when electrons flow from N-type to P-type material, the temperature of the junction increases. [0003] At present, semiconductor refrigeration chips are made up of many N-type and P-type semiconductor particles arranged with each other, and N / P are connected by commo...

Claims

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Application Information

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IPC IPC(8): H01L35/32H01L35/30
Inventor 雍占锋
Owner 雍占锋
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