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Injection molding encapsulation die structure

A technology of injection molding and overmolding, which is applied in the field of injection molding and overmolding mold structure, can solve the problems of increasing the factory cost, reducing the service life of the product, reducing the yield of the finished product, etc., and achieving the effects of increasing the service life, preventing falling off, and reducing the cost of leaving the factory.

Active Publication Date: 2013-04-03
SUZHOU BENTENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing products need to be glued after being injected into the shell, because there is no glue in one direction. If the glue is not strong, the shell and the glue are easy to fall off, which will reduce the service life of the product. And reduce the yield, increase the factory cost

Method used

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  • Injection molding encapsulation die structure
  • Injection molding encapsulation die structure

Examples

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Embodiment Construction

[0012] Such as figure 1 with figure 2 An injection overmolding mold structure is shown, including a support plate 2, a backing plate 1 is provided on the support plate 2, a base 3 is provided on the backing plate 1, a male mold core 6 is arranged above the base 3, and the male mold core 6 is fixed In the horizontal direction, the bottom plate 3 is provided with a return needle 4 and a movable core 5 passing through the male mold core 6, and the bottom plate 3 on both sides of the support plate 2 is provided with a laterally moving slider unit. The first female mold core 6 is provided with a first female mold core 8 and a second female mold core 9, and the first female mold core 8 is provided with a cavity to cooperate with the return pin 4; the slider unit includes a slider 10 , the slide block 10 is provided with a chute, the chute is provided with a slant lock 9, the height of the slide block 10 is higher than the height of the support plate 2; the return pin 4 is two; the...

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Abstract

The invention relates to an injection molding encapsulation die structure, which includes a support plate, wherein a bottom plate is arranged on the support plate; a base is arranged on the bottom plate; a male die insert is arranged above the base and fixed horizontally; return pins and movable cores both penetrating through the male die insert are arranged on the base; horizontally moving sliding block units are arranged under the base on the two sides of the support plate; a first female die insert and a second female die insert are arranged on the male die insert; and a cavity is arranged on the first female die insert to be matched with the return pins. Through the adoption of the structure, when the die is used for encapsulation, the edges of a casing can be encapsulated to prevent the casing from falling off, so that the service life of the product can be prolonged, and the ex-factory cost of the product can be reduced further.

Description

technical field [0001] The invention relates to a mold structure in the injection molding industry, in particular to an injection molding overmolding mold structure. Background technique [0002] Injection molding is a processing method used in the mass production of certain complex-shaped parts. Specifically, it refers to injecting the heated and melted material into the mold cavity by high pressure, and after cooling and solidifying, a molded product is obtained. Existing products need to be glued after being injected into the shell, because there is no glue covering in one direction. If the glue is not strong, the shell and the glue are easy to fall off, which will reduce the service life of the product. And reduced yield, increased factory cost. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an injection molding overmolding mold structure that can make the overmolding stick on the shell and is not easy to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/26
Inventor 侯强赖科敏
Owner SUZHOU BENTENG PLASTIC
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