Package sandwich antenna for phase calibration

Abstract

The invention relates to a horn antenna, in particular to a package sandwich antenna for phase calibration. The antenna comprises a micro-strip feeder (1), a horn antenna (2) and plated-through holes (3) which are integrated on a dielectric substrate (4), the dielectric substrate (4) is disposed on an inner layer of a three-dimensional package (5), one end of the micro-strip feeder (1) is connected with an internal circuit (8) through a coplanar waveguide (7) on the side face of the package, the horn antenna (2) is composed of a bottom metal plane (9), a top metal plane (10) and plated-through hole side walls (11), through hole arrays (16) composed of the plated-through holes (3) form a plurality of dielectric-filled waveguides (17) in the horn antenna (2), and one port of each dielectric-filled waveguide (17) faces the direction of the micro-strip feeder (1) while the other port of each dielectric-filled waveguide (17) is positioned on an antenna aperture surface (12). The antenna is capable of improving antenna aperture efficiency as well as increasing antenna aperture gain.

Description

technical field [0001] The invention relates to a horn antenna, in particular to a package sandwich antenna with phase alignment. Background technique [0002] Using stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, for which it is also necessary to integrate the antenna on the package. Usually, the antenna is integrated on the surface of the package, for example, the patch antenna is integrated on the top of the package. But sometimes it is necessary to integrate the antenna in an interlayer in the middle of the package to meet the needs of the system. The above requirements can be achieved if the horn antenna is integrated in the interlayer inside the package. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-integrat...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The reason is that the horn The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the electric field intensity of the aperture is uneven, and the radiation directivity and gain decrease

At present, methods such as dielectric loading and dielectric prism have been used to correct the asynchronous phase of the horn aperture surface, but these phase alignment structures increase the overall structural size of the antenna and are not suitable for integration into the interlayer inside the package.

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