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Silicon slice automatic slice counting method based on electronic balance
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A technology of electronic balances and silicon wafers, used in measuring devices, instruments, weighing, etc.
Active Publication Date: 2013-04-10
ZHEJIANG COWIN ELECTRONICS
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[0006] In the actual production process, especially in the shipment inspection process, the check of the number of pieces is very important. The traditional manual spotting cannot meet the high requirements of the existing production for product quality. The photoelectric spotting machine is used in the semiconductor silicon wafer manufacturing industry. Apps have inherent flaws that cannot be avoided
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Embodiment 1
[0044] The actual use steps of the present invention: (Use 285-290, 3-inch round silicon wafers, 211pcs waiting for confirmation. According to the principle, the single maximum count n=56.)
[0045] 1. Turn on the switch of the device and place the basket containing the silicon wafers on the balance.
[0046] 2. When the display is stable, click Tare.
[0047] 3. Place the test weight on the basket and confirm that the weight display is consistent with the weight identification.
[0048] 4. Enter the thickness of the silicon wafer 285-290, and select "3 inch", "wafer".
[0049] 5. Put the wafers to be counted into the basket in batches, and click "Accumulate".
[0050] 6. If there are too many films inserted at one time, it will display "Exceeded" and will not be counted into the cumulative number of films.
[0051] 7. Repeat steps 5-6 to get the final total number of pieces. Get "exceeded", "56", "55", "exceeded", "55", "45" respectively.
[0052] 8. "Total number of pieces" displays 211...
Embodiment 2
[0055] Shipment inspection, N14, 295-300 microns, 501pcs, wafers, 1pcs filter paper per 50pcs interval, of which 51pcs for 1 slice of silicon wafers, the final inspection piece number is fully inspected using the device of the invention, the final inspection requires 500pcs / box, 50pcs / Knife.
[0056] The inspection conditions are as follows:
[0057] Testing frequency
Embodiment 3
[0059] 5-inch single reference surface, asymmetrical chamfered silicon wafer, thickness 525-530 microns. The number of slices is unknown, and the device and method of the present invention are used to calculate the number of slices.
[0060] 1. Enter the thickness upper and lower line, and get the single maximum count value n=104pcs.
[0061] 2. Select the size "5 inch", "single reference surface", and press "cumulative" to count.
[0062] 3. It is counted multiple times, which are "52", "46", "68", "42", and "45" for a total of 253pcs.
[0063] 4. It is checked by manual counting method, which is 253pcs, which is consistent with the result of the counting device.
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Abstract
The invention discloses a silicon slice automatic slice counting method based on an electronic balance. The steps are as follows. Firstly, a choice is made for silicon slices which need to be weighted on a numerical value input device, a siliconslice thickness selecting and display device, a silicon slice specification selecting device and a silicon slice size selecting device. Secondly, an inner signalprocessing device disposes and figures out the number of slices of the silicon slice according to a weighting device, a silicon slice area calculating device, a silicon slice size calculating device and a silicon slice slice calculating device, and the number of the slices is shown on a calculating result display device. Based on a common electronic balance, the silicon slice automatic slice counting method based on the electronic balance mainly uses fixed physical property between weight and density to achieve slice calculation, is capable of achieving the slice calculation of the silicon slice, has the advantages of being convenient, practical and cheap.
Description
Technical field [0001] The invention belongs to the field of semiconductorwaferprocessing and manufacturing in the integrated circuit support industry, and particularly relates to an automatic wafer counting method based on an electronic balance, which is suitable for weighing and counting semiconductor wafers. Background technique [0002] The semiconductorwafer manufacturing industry belongs to the integrated circuit support industry. It has always been a key support industry and strategic emerging industry. The number of semiconductor wafers has long been completed by manual dots. Manual dots are inevitable. Data errors will occur. In the extremely rigorous field of production in the semiconductor industry, the number of pieces of error will greatly affect the image of the product; it also has an adverse effect on the traceability of production data; in addition, manual dots will increase the scratches on the surface of the silicon wafer and increase inspection loss. [0003...
Claims
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Application Information
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