Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon slice automatic slice counting method based on electronic balance

A technology of electronic balances and silicon wafers, used in measuring devices, instruments, weighing, etc.

Active Publication Date: 2013-04-10
ZHEJIANG COWIN ELECTRONICS
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the actual production process, especially in the shipment inspection process, the check of the number of pieces is very important. The traditional manual spotting cannot meet the high requirements of the existing production for product quality. The photoelectric spotting machine is used in the semiconductor silicon wafer manufacturing industry. Apps have inherent flaws that cannot be avoided

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon slice automatic slice counting method based on electronic balance
  • Silicon slice automatic slice counting method based on electronic balance
  • Silicon slice automatic slice counting method based on electronic balance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The actual use steps of the present invention: (Use 285-290, 3-inch round silicon wafers, 211pcs waiting for confirmation. According to the principle, the single maximum count n=56.)

[0045] 1. Turn on the switch of the device and place the basket containing the silicon wafers on the balance.

[0046] 2. When the display is stable, click Tare.

[0047] 3. Place the test weight on the basket and confirm that the weight display is consistent with the weight identification.

[0048] 4. Enter the thickness of the silicon wafer 285-290, and select "3 inch", "wafer".

[0049] 5. Put the wafers to be counted into the basket in batches, and click "Accumulate".

[0050] 6. If there are too many films inserted at one time, it will display "Exceeded" and will not be counted into the cumulative number of films.

[0051] 7. Repeat steps 5-6 to get the final total number of pieces. Get "exceeded", "56", "55", "exceeded", "55", "45" respectively.

[0052] 8. "Total number of pieces" displays 211...

Embodiment 2

[0055] Shipment inspection, N14, 295-300 microns, 501pcs, wafers, 1pcs filter paper per 50pcs interval, of which 51pcs for 1 slice of silicon wafers, the final inspection piece number is fully inspected using the device of the invention, the final inspection requires 500pcs / box, 50pcs / Knife.

[0056] The inspection conditions are as follows:

[0057] Testing frequency

Embodiment 3

[0059] 5-inch single reference surface, asymmetrical chamfered silicon wafer, thickness 525-530 microns. The number of slices is unknown, and the device and method of the present invention are used to calculate the number of slices.

[0060] 1. Enter the thickness upper and lower line, and get the single maximum count value n=104pcs.

[0061] 2. Select the size "5 inch", "single reference surface", and press "cumulative" to count.

[0062] 3. It is counted multiple times, which are "52", "46", "68", "42", and "45" for a total of 253pcs.

[0063] 4. It is checked by manual counting method, which is 253pcs, which is consistent with the result of the counting device.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a silicon slice automatic slice counting method based on an electronic balance. The steps are as follows. Firstly, a choice is made for silicon slices which need to be weighted on a numerical value input device, a silicon slice thickness selecting and display device, a silicon slice specification selecting device and a silicon slice size selecting device. Secondly, an inner signal processing device disposes and figures out the number of slices of the silicon slice according to a weighting device, a silicon slice area calculating device, a silicon slice size calculating device and a silicon slice slice calculating device, and the number of the slices is shown on a calculating result display device. Based on a common electronic balance, the silicon slice automatic slice counting method based on the electronic balance mainly uses fixed physical property between weight and density to achieve slice calculation, is capable of achieving the slice calculation of the silicon slice, has the advantages of being convenient, practical and cheap.

Description

Technical field [0001] The invention belongs to the field of semiconductor wafer processing and manufacturing in the integrated circuit support industry, and particularly relates to an automatic wafer counting method based on an electronic balance, which is suitable for weighing and counting semiconductor wafers. Background technique [0002] The semiconductor wafer manufacturing industry belongs to the integrated circuit support industry. It has always been a key support industry and strategic emerging industry. The number of semiconductor wafers has long been completed by manual dots. Manual dots are inevitable. Data errors will occur. In the extremely rigorous field of production in the semiconductor industry, the number of pieces of error will greatly affect the image of the product; it also has an adverse effect on the traceability of production data; in addition, manual dots will increase the scratches on the surface of the silicon wafer and increase inspection loss. [0003...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01G19/42
Inventor 孙新利
Owner ZHEJIANG COWIN ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com