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Camera module and system comprising same

A technology of camera modules and digital cameras, applied in parts of TV systems, parts of color TVs, radiation control devices, etc., can solve problems such as unsuitable solutions

Active Publication Date: 2013-04-24
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inappropriate solution for small, thin, lightweight portable devices

Method used

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  • Camera module and system comprising same
  • Camera module and system comprising same
  • Camera module and system comprising same

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Embodiment Construction

[0014] Embodiments of a low profile camera module with integrated electromagnetic interference (EMI) protection are described herein. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. One skilled in the relevant art will recognize, however, that the techniques described herein may be practiced without one or more of the detailed details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring certain aspects.

[0015] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this speci...

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Abstract

Embodiments of the invention describe an electro-magnetic interference (EMI) shield cover disposed over a wafer level camera module. Said camera module includes substrate having a plurality of imaging pixels, an imaging lens unit disposed on a top side the substrate and a plurality of conductive connectors disposed a bottom side of the substrate, wherein at least one of the conductive connectors comprises a ground connector. The substrate further includes a thru-silicon via (TSV) accessible on the top-side of the substrate and communicatively coupled to the ground connector. The EMI shield is communicatively coupled to the TSV, and thus coupled to the ground connection of the digital camera module.

Description

technical field [0001] The present invention relates generally to camera modules, and more particularly, but not exclusively, to digital camera modules with integrated electromagnetic interference (EMI) protection. Background technique [0002] Mobile electronic devices with image capture capabilities, such as cellular telephones, are becoming more and more popular. The technology used to fabricate image sensors, and particularly complementary metal-oxide-semiconductor (CMOS) and charge-coupled device (CCD) image sensors, has continued to advance rapidly. Demands for higher resolution, lower power consumption, and smaller devices have fueled further miniaturization and integration of image sensors and other associated elements required to make up digital camera modules. [0003] Many digital camera modules require protection from electromagnetic interference (EMI) that can occur when the camera is mounted close to other electronic components. Figure 1 is an illustration of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L27/146H04N5/225
CPCH04N5/2252H01L27/1464H04N5/225H01L27/14618H01L27/14623H04N5/3577H01L27/146H01L27/14627H01L23/552H01L27/14625H01L2224/13H01L2224/16225H04N23/51H04N25/617
Inventor 林蔚峰蔡陈纬
Owner OMNIVISION TECH INC