Mold for local gold plating of cover plate
A technology of partial gold plating and cover plate is applied in the field of electroplating molds and molds with partial gold plating of cover plates, which can solve the problems of long process flow, high electroplating cost, and many process steps, and achieve the effect of low cost and simplified process
Active Publication Date: 2015-07-15
宜兴市吉泰电子有限公司
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Problems solved by technology
[0002] At present, the process method of partial electroplating gold and other precious metals on the metal cover plate in electronic packaging usually adopts glue coating → exposure → development → partial electroplating → deglue, or the process method of covering the parts that do not need electroplating and then partial electroplating, these The process method of partial electroplating precious metals has the following problems: 1. There are many process steps and the process flow is long; 2. The cost of electroplating is relatively high
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[0026] The present invention will be further described below in conjunction with specific drawings.
[0027] Such as Figure 1 ~ Figure 3 As shown: the mold for partial gold plating of the cover plate includes a positioning plate 1, a cover plate 2, a boss 3, a flat plate 4, a magnetic steel 5, an insulating layer 6, a gold-plated layer 7, a positioning pin 8, a positioning hole 9, Mounting holes 10, through holes 11, etc.
[0028] Such as Figure 1 ~ Figure 3 As shown, the present invention includes a flat plate 4 and a positioning plate 1 covered on the upper surface of the flat plate 4, and the flat plate 4 is provided with an electrode interface connected to an electroplating power supply; positioning pins 8 are set on both sides of the positioning plate 1, and the positioning The pin 8 cooperates with the positioning hole 9 on the flat plate 4 to fix the relative position of the flat plate 4 and the positioning plate 1;
[0029] Such as Figure 4 , Figure 5 As shown...
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The invention relates to a mold for the local gold plating of a cover plate. The mold is characterized by comprising a panel and a locating plate covering the upper surface of the panel, wherein a plurality of mounting holes are distributed in the locating plate in an array way; the shape and size of the mounting holes are consistent with those of the cover plate to be electroplated; a plurality of bosses are distributed on the panel in an array way and correspond to the mounting holes in the locating plate one to one but are smaller than the mounting holes in area; and a magnetic steel is embedded inside each boss. The panel is provided with an electrode interface connected with an electroplating power supply. Locating pins are arranged on the two sides of the locating plate and are matched with the locating holes in the panel. The panel between adjacent bosses is provided with a plurality of through holes. Insulating layers are coated on the external surface of the panel and the side surfaces of the bosses. According to the mold provided by the invention, the local electroplating process is simplified, such procedures as local gluing, exposure, developing, or protective film sticking, removal of photoresist after electroplating or film uncovering are saved, and the cost is low.
Description
technical field [0001] The invention relates to an electroplating mold, in particular to a mold for partial gold plating on a cover plate, which belongs to the technical field of electronic packaging. Background technique [0002] At present, the process method of partial electroplating gold and other precious metals on the metal cover plate in electronic packaging usually adopts glue coating → exposure → development → partial electroplating → deglue, or the process method of covering the parts that do not need electroplating and then partial electroplating, these The process method of partial electroplating precious metals has the following problems: 1. There are many process steps and the process flow is long; 2. The cost of electroplating is relatively high. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a mold for partial gold plating on the cover plate, which can realize one-time par...
Claims
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IPC IPC(8): C25D5/02
Inventor 马国荣李保云
Owner 宜兴市吉泰电子有限公司