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Optoelectronic semiconductor component and method for producing it

A technology for optoelectronic semiconductors and optoelectronic devices, applied in semiconductor devices, electro-solid devices, electrical components, etc., can solve problems such as device thermal resistance variation, and achieve the effect of simplifying the manufacturing process and simplifying external fixation

Inactive Publication Date: 2013-05-01
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the use of ceramic and metal core circuit boards, the thermal resistance of the entire device is deteriorated

Method used

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  • Optoelectronic semiconductor component and method for producing it
  • Optoelectronic semiconductor component and method for producing it
  • Optoelectronic semiconductor component and method for producing it

Examples

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Embodiment Construction

[0040] Identical or identically acting components are each provided with the same reference symbols. The shown components and the size relationship of the component parts to each other are not to be regarded as true to scale.

[0041] FIG. 5 shows a conventional optoelectronic semiconductor component 10 with a semiconductor chip 1 , a carrier 2 and a metal-core circuit board 3 . The semiconductor chip 1 is applied to the carrier 2 , for example by means of an adhesive layer or a solder layer. The carrier 2 is arranged on the metal-core circuit board 3 by means of a fastening layer 5 .

[0042] The carrier 2 has AlN. The metal core circuit board 3 has Al, for example. The fixed layer 5 is, for example, a silver layer.

[0043] In conventional optoelectronic components, a metal-core circuit board 3 and a carrier 2 are therefore used, on which the semiconductor chip 1 is arranged. In particular, this conventional device has three components, namely a chip 1 , a carrier 2 and...

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PUM

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Abstract

An optoelectronic semiconductor component (10) is provided, comprising a carrier (2) and a semiconductor chip (1). The semiconductor chip (1) comprises an active layer for generating electromagnetic radiation. The carrier (2) comprises electrical conductor tracks (6) on a top side for making electrical contact with the semiconductor chip (1). The semiconductor chip (1) is fixed on the carrier (2). The carrier (2) contains Si3N4 or molybdenum. A method for producing such a component (10) is furthermore specified.

Description

technical field [0001] The invention relates to an optoelectronic semiconductor component according to claim 1 , having a carrier and a semiconductor chip. Furthermore, the invention relates to a method for producing such an optoelectronic component according to claim 10 . Background technique [0002] A housing for an optoelectronic component is described in publication DE 11 2005 002 419 T5. [0003] Traditionally, optoelectronic semiconductor devices have a semiconductor chip which is arranged on an AlN ceramic. The AlN ceramic with the applied semiconductor chip is applied to the metal core circuit board, for example bonded to the metal core circuit board. Disadvantageously, AlN ceramics can be soldered to metal core circuit boards due to the coefficient of thermal expansion. However, due to the use of ceramic and metal core circuit boards, the thermal resistance of the entire device is deteriorated. For example, in this device, the thermal resistance of the entire d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H05K1/02H05K1/03H05K1/05F21K99/00H01L25/075H01L33/48
CPCH01L2924/0002H01L33/486H05K2201/10106H05K1/0306H01L33/64H01L33/62H01L2224/48091H01L2224/73265H01L33/641H01L2924/00014
Inventor M.皮希尔迈尔
Owner OSRAM OPTO SEMICON GMBH & CO OHG