246results about "Light sources" patented technology

An (Al, Ga, In)N light emitting diode (LED), wherein light extraction from chip and / or phosphor conversion layer is optimized. By novel shaping of LED and package optics, a high efficiency light emitting diode is achieved.

A lighting device, comprising a solid state light emitter and a light filter. At least a portion of light emitted by the light emitter contacts the filter, and at least part of the light passes through the filter. Also, such lighting devices further comprising lumiphor, in which at least some of the first part of the light is absorbed by the lumiphor, which then emits light, and at least a portion of any light emitted by the lumiphor directed toward the filter is reflected by the filter. Also, a method of lighting, comprising illuminating a solid state light emitter in such devices. Also, a lighting device, comprising a solid state light emitter; a lumiphor and filter means for allowing at least a portion of light emitted by the light emitter to pass through and for reflecting a second portion of light emitted by the lumiphor after the lumiphor is excited.

A light source apparatus of the present invention comprises a semiconductor light emitting device which emits light, a wavelength converting member which receives the light emitted by the semiconductor light emitting device and emits light of a wavelength longer than that of the original light, and a wavelength selecting member which is disposed between the semiconductor light emitting device and the wavelength converting member and reflects and transmits the incident light with different reflectivity and different transmittance depending on the wavelength of the incident light.

A light emitting device, comprises at least: a light emitting element; a wavelength conversion member for converting the wavelength of light from the light emitting element; a bendable light guide member for guiding light from the light emitting element to the wavelength conversion member; and a heat conduction member that is thermally connected to the wavelength conversion member.

The present invention aims to provide a semiconductor light emitting device (1) that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. In order to achieve the above object, the semiconductor light emitting device (1) according to the present invention includes a luminous layer (23), a light transmission layer (10) disposed over a main surface of the luminous layer (23), and having depressions (11) on a surface facing away from the luminous layer (23), and a transmission membrane (70) disposed on the light transmission layer (10) so as to follow contours of the depressions, and light from the luminous layer (23) is irradiated so as to pass through the light transmission layer (10) and the transmission membrane (70).

A nanowire array is described herein. The nanowire array comprises a substrate and a plurality of nanowires extending essentially vertically from the substrate; wherein: each of the nanowires has uniform chemical along its entire length; a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. This nanowire array is useful as a photodetector, a submicron color filter, a static color display or a dynamic color display.

A backlight assembly includes a circuit board and a plurality of point light source groups. The plurality of point light source groups includes N point light sources that generate different respective colors and being arranged on the circuit board. Here, N is a number of point light sources. One light source group of the light source groups is rotated by an angle of predetermined degrees in a clockwise direction or a counter-clockwise direction with respect to another light source group that is adjacent to the one point light source group.

A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

A light-emitting diode (LED) lighting apparatus includes a transparent flexible tape with a first transparent pattern and a second transparent pattern, the first transparent pattern being insulated from the second transparent pattern. A plurality of light-emitting diodes is electrically connected with the first transparent pattern. The LED lighting apparatus can also form the first transparent pattern and the second transparent pattern on two sides of the transparent flexible tape, or, furthermore, to form the first transparent pattern and the second transparent pattern stack to generate a multi-story LED lighting apparatus. Such a plane of emitting diode is applied to various display, furniture decoration and lighting.

A light emitting device, comprises at least: a light emitting element; a wavelength conversion member for converting the wavelength of light from the light emitting element; a bendable light guide member for guiding light from the light emitting element to the wavelength conversion member; and a heat conduction member that is thermally connected to the wavelength conversion member.

An automotive headlamp is provided that includes a digital micromirror device (DMD) headlight module, the DMD headlight module including a DMD, a white light module to provide a white light beam to illuminate the DMD, illumination optics optically coupled between the DMD and the white light module to prepare the white light beam for illuminating the DMD, and projection optics optically coupled to the DMD to receive pixelated light reflected by the DMD and project a pixelated light beam on road, in which at least one of the DMD, the white light module, and the illumination optics shape a beam profile of the white light beam such that the light reflected by the DMD has a pixelated non-uniform beam profile suitable for projecting a white light beam that forms a portion of a white light beam of the headlamp.

A fluorescence concentrator system that provides for high brightness light source. The system can include a host doped with fluorescent material, which is optically pumped by an adjacent illumination source. The fluorescence concentrator captures a portion of the isotropically emitted fluorescent light and guides it to an output surface. The fluorescent energy emerging the output surface provides a high brightness light source suitable for a number of applications. For example, the fluorescence concentrator system can be used as the light source in a medical apparatus suitable for various aesthetic procedures. Further aspects of the fluorescent concentrator system can include providing for controlling the illumination source to output pumping energy suitable for high energy applications.

In certain example embodiments, light emitting diodes (LEDs) may be disposed on a deformable and flexible backbone sheet and chained together in an array, e.g., via flexible wiggle wires. Such flexible wiggle wires may also provide an electrical connection to an external power source. An optical out-coupling layer stack (OCLS) system may help serve as an index matching layer, heat sink, étendue conserver, etc. The backbone may be formed to a shape tailored to its ultimate application. Applications may include, for example, automotive (such as Center High Mounted Stop Lamp (CHMSL) applications), lighting, signage, and / or other applications. In an example CHMSL application, the deformable sheet with the LED array thereon has a step, sinusoidal, or other shape matched to the angle and / or curvature of the glass such that the LEDs produce light primarily in a direction parallel to a surface on which a vehicle is located.

A semiconductor radiation source has a base body on which at least two LED chips are directly mounted and are fitted to the base body using a thermally conductive connection. At least one printed circuit board is mounted on the base body and extends from the centrally arranged LED chips to the outside, in particular to the peripheral region of the base body, and projects, in particular, into free areas which extend laterally beside the chips or between the latter.

There is provided a lens formed from a circular bottom face (11), lateral face (14) and top face (15) and having a surface light source (13) of a finite size disposed at the center of the bottom face (11). The top face (15) is an aspheric surface rotational symmetric with respect to a z-axis and which totally reflects a part of a component, whose polar angle is smaller than a polar angle Θ0 at the intersection between the lateral face (14) and top face (15), of light emitted from the surface light source (13). The lateral face (14) is an aspheric surface rotational symmetric with respect to the z-axis and pervious to a component, whose polar angle is larger than the polar angle Θ0, and component, totally reflected at the top face (15), of the light emitted from the surface light source (13). A function r=fS(z) where z is a variable representing the lateral face (14) increases monotonously as the variable z decreases in a closed zone defined by 0≦z≦z1 (z-coordinate of an intersection between the lateral face (14) and top face (15)), and has at least one point where a absolute value |d2r / dz2| is maximum in the closed zone.

An illuminator (1) is manufactured by embossing an aluminium preform to provide a structured substrate base (21) with cavities (25) for LEDs and recesses (26) for tracks. The substrate is anodised to provide an aluminium oxide insulating layer (30) over the structured surface. A metal layer (35) is then applied over the insulating layer (30), and this is etched to leave metal pads in the cavities and tracks in the recesses (26). LEDs (50) are placed in the cavities and they are wire-bonded to the exposed metal tracks. This manufacturing method allows versatility in choice of configuration of 5 illuminator by simple embossing a desired substrate shape. Also, the anodisation provides an excellent and durable insulating layer, which has the major benefit of being conformal with the structured surface.

A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.

A method and apparatus which uses the edge emitting characteristics of the LED bare chip to form a backlight with uniform illumination. This allows a reduced separation between the diffuser plate and the LED array. In one embodiment, the LED chip(s) is mounted over a prism structure, which redirects the side emitted light outwards.

A laryngoscope has a laryngoscope spatula, a handle, and an illumination device for illuminating the oral and pharyngeal cavity, the illumination device having at least a first light-radiating element, which is arranged on the laryngoscope spatula and, when operating, radiates a cone of light with an angle of beam spread. The illumination device has at least a second light-radiating element, which is likewise arranged on the laryngoscope spatula, and the at least one second light-emitting element radiates a second cone of light with a second angle of beam spread which is greater than the angle of beam spread of the cone of light of the first light-radiating element.

A backlight assembly and a liquid crystal display having the same are provided. The backlight assembly includes a light source unit including a circuit board and a light emitting diode mounted on the circuit board, a chassis on which the light source is disposed, and a first fastening unit for fastening the light source to the chassis. The first fastening unit includes a first fastening hole formed in the circuit board, and a protrusion formed on the chassis. The protrusion is inserted into the first fastening hole to be fastened thereto.

A lighting device having a light emitting diode (LED). The device includes a metal substrate having a surface. A dielectric coating layer is superimposed on the surface of the metal substrate. A light emitting diode (LED) is supported on the dielectric coating layer. The metal substrate serves as a heat sink for the heat emitted by LED during operation.

A plane structure of light-emitting diode (LED) lighting apparatus is provided, it includes a transparent flexible tape with a first transparent pattern and a second transparent pattern, wherein the first transparent pattern is insulated from the second transparent pattern. A plurality of light-emitting diodes is electrically connected with the first transparent pattern. The LED lighting apparatus can also form the first transparent pattern and the second transparent pattern on two sides of the transparent flexible tape, or, furthermore, to form the first transparent pattern and the second transparent pattern stack to generate a multi-storey LED lighting apparatus. Such a plane of emitting diode is applied to various display, furniture decoration and lighting.

In the case where RGB light emitting elements are used as light sources of a surface emitting type illumination device, the occurrence of color irregularity in the vicinity of a light incident surface is prevented, so that uniform white light is obtained on an entire light outgoing surface. In a light source device including light emitting elements of respective colors including red light emitting elements, green light emitting elements, and blue light emitting elements that emit light in a red (R) wavelength range, light in a green (G) wavelength range, and light in a blue (B) wavelength range, respectively, the light emitting elements being provided on one principal surface of a substrate, the light emitting elements of the respective colors are aligned in a longitudinal direction of the substrate, the number of the green light emitting elements is larger than the number of each of the red light emitting elements and the blue light emitting elements, and the light emitting elements of the respective colors in the longitudinal direction of the substrate are aligned at regular Intervals for each of the colors.

The invention provides a fluorescent powder lamella, a fluorescent powder color wheel, and a light source using the fluorescent powder lamella. The fluorescent powder color wheel comprises a substrate and the fluorescent powder lamella, wherein the fluorescent powder lamella comprises a lamella which is formed by bonding fluorescent powder particles with an organic or inorganic binder; the granularity of the fluorescent powder D50 is greater than or equal to 20 mu m; the fluorescent powder lamella covers at least one part of the one side surface or forms at least one part of the substrate, and can be excited and converted into excited light of at least one color. Compared with the prior art, the fluorescent powder lamella, the fluorescent powder color wheel, and the light source using the fluorescent powder lamella provided by the invention adopt the fluorescent powder of which the granularity D50 is greater than or equal to 20 mu m; and high efficiency of the fluorescent powder lamella can still be maintained in high exciting light power density.

In one embodiment, a light emitting panel includes a base panel and a plurality of light emitting elements mounted to the base panel. Each of the light emitting elements produces an illumination pattern having a region of substantially uniform intensity that extends over a radiation angle of at least about 60°. One or more light conditioners are positioned adjacent the base panel to receive and condition light produced by the light emitting elements.

A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.

A light guiding device and a thin display comprising the same are disclosed. The thin display comprises a light guiding device, a panel, and a frame. The frame comprises two arc-shaped frames opposite each other and two side frames opposite each other. The light guiding device comprises a light guiding plate and a light source device. The light guiding plate comprises an upper curve surface, a lower curve surface, a first arc-shaped plane, and a second arc-shaped plane. Two edges of each of the upper and the lower curve surfaces are connected with the first arc-shaped plane and the second arc-shaped plane respectively. The light source device is disposed between one of the first and the second arc-shaped planes and one of two arc-shaped frames. The panel is disposed in the frame and above the light guiding device.

A lighting device, comprising a solid state light emitter and a light filter. At least a portion of light emitted by the light emitter contacts the filter, and at least part of the light passes through the filter. Also, such lighting devices further comprising lumiphor, in which at least some of the first part of the light is absorbed by the lumiphor, which then emits light, and at least a portion of any light emitted by the lumiphor directed toward the filter is reflected by the filter. Also, a method of lighting, comprising illuminating a solid state light emitter in such devices. Also, a lighting device, comprising a solid state light emitter; a lumiphor and filter means for allowing at least a portion of light emitted by the light emitter to pass through and for reflecting a second portion of light emitted by the lumiphor after the lumiphor is excited.

An LED chip (104), mounted on a substrate (106), emits a first primary light. A wavelength-converting overlay (102) is disposed on the LED chip, the overlay comprising quantum dots (114,116,118) dispersed in a matrix material (122). A second light source provides a second color of light.

A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.