Optical wavelength conversion component, its preparation method and white light emitting device

A technology of wavelength conversion and components, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problems of reduced light efficiency of devices, deterioration of phosphor luminescence characteristics, etc., and achieves enhanced heat dissipation effect, ease of heat dissipation problems, and low ambient temperature.

Active Publication Date: 2016-03-30
铜陵市同威科技有限公司
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  • Abstract
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Problems solved by technology

[0003] The object of the present invention is to provide an optical wavelength conversion component, a manufacturing method, and a white LED light-emitting device manufactured by using a resin substrate containing a fluorescent resin coating, which can effectively solve the above problems in the light-emitting device manufactured by using the traditional LED packaging process. Decreased device luminous efficiency and degradation of phosphor luminescence characteristics, etc.

Method used

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  • Optical wavelength conversion component, its preparation method and white light emitting device
  • Optical wavelength conversion component, its preparation method and white light emitting device
  • Optical wavelength conversion component, its preparation method and white light emitting device

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Embodiment Construction

[0022] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.

[0023] figure 1 It is a schematic structural diagram of an optical wavelength conversion component according to an embodiment of the present invention. The optical wavelength conversion component includes a resin substrate 11 and a mixed coating 12 containing resin and phosphor powder 13 on the surface of the resin substrate.

[0024] The material of the resin substrate 11 is PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, styrene-butadiene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC reinforced PMMA or MS resin; resin powder material is PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, styrene-butadiene, phenylsulfone resin, CR-39, MS, NAS, nylon or PC reinforced PMMA or MS resin; resin The substrate and the resin powder may be of the same kind...

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Abstract

The invention provides an optics wavelength conversion module, a preparation method of the optics wavelength conversion module and a white light light-emitting device. The optics wavelength conversion module comprises a resin substrate, a blended coating comprising resin and fluorescent powder is arranged on the surface of the resin substrate. The mass ratio of resin power to the fluorescent powder is 100:1 to 20:150, and the mass ratio of a solvent to a binder is 100:1 to 100:100. The volume ratio of the general volume of a mixture of the fluorescent power and the resin power to the general volume of the solvent and the binder is 1:100 to 300:100, and the grain size of the resin power and the fluorescent powder is between 1 micrometer and 60 micrometers. The optics wavelength conversion module, the preparation method of the optics wavelength conversion module and the white light light-emitting device can effectively solve the problems that light efficiency of the element is reduced, a light-emitting characteristic of the fluorescent powder is deteriorated and the like in the light-emitting device manufactured by traditional light-emitting diode (LED) technology.

Description

technical field [0001] The invention relates to the field of LED lighting, and in particular relates to an optical wavelength conversion component, a preparation method thereof and a white light emitting device. Background technique [0002] As a new type of lighting source, white LEDs work on the principle of using a combination of blue chips and yellow phosphors (or other combinations) to obtain white light. Traditional LED packaging is to mix silica gel or resin with phosphor and then directly coat the surface of the blue light chip. However, this packaging method has its inherent disadvantages. Poor heat dissipation of the LED device will lead to an increase in the operating temperature of the device, causing the luminous wavelength of the phosphor to drift and the luminous intensity to decrease. On the other hand, the phosphor powder with larger particles can fully mix the light, and at the same time, it will also reflect a part of the light into the blue chip, which a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/56H01L33/50
Inventor 殷江钱志强
Owner 铜陵市同威科技有限公司
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