white light led lighting device

Abstract

A white LED light-emitting device, comprising a base, a blue LED chip, a reflector and a transparent substrate containing a phosphor coating, the two ends of the reflector are respectively connected to the base and the substrate, and a reflective layer is provided on the internal reflection surface of the reflector, and the blue LED The chip is arranged on the base facing the side of the transparent substrate with phosphor coating, and the electrode leads of the blue LED chip pass through the base; wherein the blue LED chip is a single chip, a group of serial, parallel or mixed chips. The transparent substrate can be planar, or convex, or cylindrical. The present invention uses the blue light emitted by the blue LED chip to irradiate the transparent substrate containing the phosphor coating to obtain white light, which reduces the luminous loss caused by the part of the light excited by the phosphor re-entering the chip and being absorbed, and also alleviates the problem of heat dissipation. There will be no luminous wavelength drift and luminous efficiency decrease due to device heat dissipation problems.

Description

technical field [0001] The invention relates to a white LED lighting device. Background technique [0002] As a new lighting method, white LED is based on the following working principle: LED blue light chip emits blue light to irradiate phosphor (phosphor powder), and phosphor is excited by blue light to emit yellow light, or mixed light of green light and red light, or yellow light. A mixture of light and red light. The light emitted by these phosphors is mixed with part of the blue light emitted by the blue chip to synthesize white light. In common encapsulation technology, the phosphor is evenly cured on the chip surface by mixing with silicone or resin. The disadvantages of this packaging method are as follows: when the device is working, the heat is too late to dissipate, resulting in an increase in the operating temperature of the device, causing the luminous wavelength of the phosphor to drift, and the luminous intensity of the phosphor to decrease. In addition, w...

AI Technical Summary

Problems solved by technology

The disadvantages of this packaging method are as follows: when the device is working, the heat is too late to dissipate, resulting in an increase in the operating temperature of the device, causing the luminous wavelength of the phosphor to drift, and the luminous intensity of the phosphor will decrease

In addition, when the phosphor is close to the surface of the blue light chip, part of the light emitted by the phosphor will re-enter the chip and be absorbed, resulting in a decrease in the luminous efficiency of the device

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