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Resin seal device and control method thereof

A resin sealing device and control mechanism technology, applied in the field of resin sealing devices, can solve problems such as heater power reduction or production restart time deviation, and achieve the effect of preventing deviation and suppressing power consumption

Active Publication Date: 2015-05-27
DAIICHI SEIKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the aforementioned method, there is a problem that the amount of reduction in heater power and the timing of restarting production may vary depending on the operator.

Method used

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  • Resin seal device and control method thereof
  • Resin seal device and control method thereof
  • Resin seal device and control method thereof

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Experimental program
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Effect test

Embodiment 1）

[0063] in Image 6 Here, the calculated value and the actual measured value show the power consumption reduction rate when the energy saving mode is set when the set time, that is, the standby time is set to 2 hours, 3 hours, and 4 hours. From that Image 6 It can be seen that the calculated value and the actual measured value are approximately the same value, and the reliability of the calculated value is high.

[0064] Therefore, use the calculated value to confirm the energy saving effect. in Figure 7 The calculated value shows the reduction in power consumption with the energy-saving mode compared to the power consumption without the energy-saving mode when the standby time is set from 2 hours to 4 hours, and 12 hours and 24 hours rate.

[0065] According to the calculated value, the longer the standby time, the higher the reduction rate of power consumption and the better the energy saving effect.

Embodiment 2）

[0067] Similarly, in order to confirm the energy saving effect, Picture 8 Here, the power consumption of the mold heater 23 with respect to the operation rate of the mold 22 when there is an energy saving mode is calculated.

[0068] in Picture 8 In the bar graph with a hollow inside, the electric power used in the apparatus 1 except for the heating of the mold heater 23 is shown. The hatched bar graph shows the electric power used to heat the mold heater 23 in the device 1. In addition, the circle marks indicate the operation rate of each mold 22. From the results of this calculation, it can be seen that the power consumption of the mold 22 in the standby time when the operation rate of the mold 22 is 0% is reduced.

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Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device which can cut power consumption on stand-by, especially power consumption of a mold heater, as well as a method for controlling a resin sealing device. SOLUTION: This resin sealing device 1 comprises: a mold 22 with a mold heater 23; a material supply unit 10 for supplying a substrate 3 to the mold 22; a conveying unit 36 which carries the substrate 3 from the material supply unit 10 into the mold 22 and at the same time unloads and carries the molded substrate 3 from the mold 22; and controllers 51 and 54 which switch the mold heater 23 OFF during the stand ready time of the mold 22 while production is suspended, and then switch the mold heater 23 ON so that the mold 22 reaches a predetermined temperature well before the stand ready time could elapse. The controllers 51 and 54 switch the mold heater 23 ON following the passing of heating stand-by time of the mold heater 23 remaining after deducting the heat-up time of the mold 22 from the stand ready time of the mold 22 in production suspension mode.

Description

Technical field [0001] The present invention relates to a resin sealing device, in particular to a resin sealing device for controlling the power supply of a mold heater and a control method of the resin sealing device. Background technique [0002] Conventionally, in an apparatus for molding resin by heating, as temperature control of the heating part when molding is interrupted, for example, Patent Document 1 describes a method of controlling the temperature of the heating cylinder when molding is interrupted. In this method, the set temperature of the heating cylinder is switched between the first set value and the second set value lower than the first set value, thereby automatically returning to the original molding time when molding is restarted Temperature to promote the plasticization of the resin. [0003] [Prior Art Literature] [0004] [Patent Literature] [0005] [Patent Document 1] Japanese Patent Laid-Open No. 08-132501 [0006] However, in the method described in Paten...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/76B29C45/73
Inventor 松岛浩二久保山慎太郎山田阳明
Owner DAIICHI SEIKO CO LTD