Air baffle structure and heat-dissipation system with air baffle structure
A heat dissipation system and heat dissipation element technology, applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve problems such as impact
Inactive Publication Date: 2013-07-03
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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- Application Information
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Problems solved by technology
The heat dissipation system 100 is used to dissipate heat generated by other electronic components (not shown) in the chassis 30. During normal operation, the two blowers 10 can dissipate the heat generated by the electronic components in the chassis 30. However, if one of the air blowers 10 has a fault and cannot work, the hot air blown by the other air blower 10 will enter the chassis 30 through the failed air blower 10 and affect the cooling of the electronic components in the chassis 30.
Method used
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Embodiment Construction
[0014] Please refer to figure 2 The heat dissipation system 200 in a preferred embodiment of the present invention includes an electronic equipment case such as a server case 40 , a number of heat dissipation elements contained in the server case 40 such as a blower 50 and a number of windshield structures 60 corresponding to the blower 50 . The blower 50 is used to discharge the heat in the server chassis 40 in time, and the windshield structure 60 is used to prevent heat backflow. In the embodiment of the present invention, the heat dissipation system 200 having two blowers 50 and two wind shielding structures 60 is taken as an example for illustration.
[0015] The server chassis 40 is roughly in the shape of a rectangular box, and two vents 41 are opened on one side wall corresponding to the blower 50 to correspond to the air outlets of the two blowers 50 .
[0016] The blower 50 is an existing impeller blower.
[0017] Please also refer to image 3 , the wind-shieldin...
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The invention provides an air baffle structure. One end of the air baffle structure is butted with heat-dissipation elements in a case of electronic equipment in a sealing manner, for the purpose of preventing outside hot air from flowing back to the case; the air baffle structure comprises a pipeline, a main body part, at least one group of baffle pieces, and a baffle strip; one end of the pipeline is butted with air vents; the main body part is mounted in the pipeline in a counterrotating manner; the baffle strip is mounted on the inner side of the pipeline, corresponding to the main body part; the baffle pieces are formed by stretching the two opposite sides of the main body part contrary, and can cross the baffle strip to rotate to a first direction; when the baffle pieces rotate to a second direction opposite to the first direction, the baffle strip stops the baffle pieces. The invention further provides a heat-dissipation system with the air baffle structure.
Description
technical field [0001] The invention relates to a windshield structure and a cooling system with the windshield structure. Background technique [0002] The active cooling mode using multiple fans or blowers is very important for electronic equipment such as servers, but the recirculation of hot air flow caused by one of the fans or blowers not working or failing to work will affect the heat dissipation of electronic equipment. Such as figure 1 As shown, a cooling system 100 for a server includes two blowers 10 and a chassis 30 . The heat dissipation system 100 is used to dissipate heat generated by other electronic components (not shown) in the chassis 30. During normal operation, the two blowers 10 can dissipate the heat generated by the electronic components in the chassis 30. However, if one of the air blowers 10 has a fault and cannot work, the hot air blown by another air blower 10 will enter the casing 30 through the failed air blower 10 and affect the cooling of th...
Claims
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Login to View More IPC IPC(8): H05K7/20G06F1/20
Inventor 张耀廷
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD