Conformal mask packaging structure and detection method

Abstract

A conformal mask packaging structure comprises a substrate, a chip module arranged on the substrate, a sealing glue body covering the chip module and the surface of the substrate, and a conductive mask layer covering the sealing glue body. The substrate is provided with a plurality of internally-grounding conductive structures which are electrically connected, and the plurality of internally-grounding conductive structures are connected with the conductive mask layer. The conformal mask packaging structure is characterized in that the substrate is provided with at least one exposed independent conductive structure which is connected with the conductive mask layer. After the conformal mask packaging structure is manufactured, a resistance value between the independent conductive structure and the conductive mask layer or another independent conductive structure or a grounding point is measured, and the resistance value is judged whether is smaller than a standard value, namely electromagnetic mask efficiency of the conformal mask packaging structure can be detected easily.

Description

technical field [0001] The present invention is related to the technology of using conformal shielding to achieve the shielding function of electromagnetic interference (EMI) in the packaging process, in particular to a conformal mask packaging structure, and to detect its shielding performance testing method, and the aforementioned packaging structure and testing method can also be applied to the situation where conformal shielding and compartment shielding are used at the same time. Background technique [0002] Conformal mask refers to the formation of a conductive mask layer on the outer peripheral surface of the electronic module by metal sputtering, spraying or other coating methods in the packaging process. Since the module has undergone substrate cutting before coating, it has multiple exposures. The outer inner grounding conductive structure is electrically connected with the inner grounding conductive structure after the conductive mask layer covers the module, thu...

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Problems solved by technology

[0003] However, the conformal mask packaging structure is prone to poor shielding performance due to poor substrate cutting, uneven conductive mask layer, or poor connection to the inner ground conductive structure. Therefore, in order to ensure the quality of conformal shielding, the package After the structure is complet

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