Method for packaging multi-lens full-view endoscope
An encapsulation method and endoscope technology, which are applied to the research field of three-dimensional encapsulation of endoscopes and can solve problems such as difficulty in forming
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] An embodiment of the present invention provides a packaging method for a multi-lens full-view endoscope, including:
[0030] Step 1: Processing and forming a rigid-flexible board, which includes a rigid board and a flexible board connected to the rigid board, wherein the rigid-flexible board can be bent to form a geometric body through the flexible board, and the rigid board is used as the surface of the geometric body, and the mechanical connection between the rigid boards And electrical interconnection is realized through flexible board;
[0031] Step 2: Mount chips, lenses, lighting devices, passive components, etc. on the rigid board of the rigid-flex board, and do plastic packaging to protect some chips;
[0032] Step 3: Connect the battery with the circuit system set on the rigid-flex board;
[0033] Step 4: Bending the rigid-flexible board to form a closed geometry and fixing it, and setting the battery in the geometry;
[0034] Step 5: Place the geometry in a ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com