Wafer Holder
A technology of wafer fixing and round holes, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as wafer damage and wafer waste
Active Publication Date: 2015-09-30
景焱(江苏)智能装备有限公司
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Problems solved by technology
The test of the wafer of the CIS chip is completed by the test machine. During the test process, the wafer must be fixed for optical testing. The existing fixing method is to press the wafer on the fixed frame by pressing the needle. , due to the high precision requirements of the wafer, the existing pressing and fixing methods are easy to cause physical damage to the wafer, resulting in waste of the wafer
Method used
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[0026] The specific implementation of the wafer fixing device of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0027] See attached figure 1 , 2 , the carrying plate 1 is similar to a circular shape, and can also be designed into other shapes, so that it is beneficial to be tested by a testing machine. There is a circular hole 2 in the middle of the carrying plate 1, and a ring is placed on the edge of the circular hole 2 Groove 3, the optical glass 4 is arranged in the annular placement groove 3, on the first side of the carrier plate 1, that is figure 1 On the left side in the center, the limiting plate 5 is fixedly arranged, the limiting plate 5 is in a semi-circular shape, the arc of its inner arc is less than 180 degrees, the inner arc of the limiting plate 5 is located above the optical glass 4, and the inner arc of the limiting plate 5 The inner diameter is smaller than the radius of the circular hole 2 . Prefe...
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The invention relates to the technical field of the treatment of an integrated circuit chip, and discloses a wafer fixing device. The wafer fixing device comprises a bearing plate, a limiting plate and a moving plate, wherein a circular hole and an optical glass are arranged in the middle of the bearing plate, the limiting plate has the shape of a semi-ring, the limiting plate is fixedly arranged at a first side of the bearing plate, the moving plate is arranged at a second side of the bearing plate, the inner diameter of the moving plate is equal to the inner diameter of the limiting plate, a guide groove and a fixed part are arranged at the second side of the bearing plate, the moving place can move within the guide groove through a guide part, the moving direction of the moving plate is a connecting wire direction between the midpoint of the inner arc of the limiting plate and the midpoint of the inner arc of the moving plate, the fixed part can fix the moving plate on one position, and the edges of the inner arcs of the limiting plate and the moving plate are respectively provided with a press ring. After the wafer fixing device is used, the surface of the wafer can not be damaged due to the mode of side edge compaction.
Description
technical field [0001] The invention relates to the technical field of integrated circuit chip processing, in particular to a wafer fixing device. Background technique [0002] CIS chip is an image signal processor chip, which is specially designed for image sensor chip, it processes the received light (image), and is widely used in scanners, fax machines, digital video cameras, and cameras. The test of the wafer of the CIS chip is completed by the test machine. During the test process, the wafer must be fixed for optical testing. The existing fixing method is to press the wafer on the fixed frame by pressing the needle. , due to the high precision requirements of the wafer, the existing pressing and fixing method is easy to cause physical damage to the wafer, resulting in waste of the wafer. Contents of the invention [0003] The object of the present invention is to solve the above technical problems and provide a wafer fixing device, in order to quickly and safely fix ...
Claims
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IPC IPC(8): H01L21/687
Inventor 朱玉萍岑刚
Owner 景焱(江苏)智能装备有限公司