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Bonding structure

A technology of bonding and sticking layers, applied in synthetic resin layered products, instruments, electrical digital data processing, etc., can solve the problems of appearance and quality defects of touch modules, and achieve the effect of avoiding bad appearance

Inactive Publication Date: 2015-07-29
INTERFACE TECH CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, after the touch module and the display module are assembled, it is often found that the viscous substance in the adhesive structure will adhere or transfer to the surface of the touch module or the display module, for example The release agent in the bonding structure will be transferred to the sensing substrate of the touch module, causing defects in the appearance and quality of the touch module

Method used

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  • Bonding structure
  • Bonding structure
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Embodiment Construction

[0013] Please also refer to Figures 1 to 3 ,in, figure 1 It is an exploded schematic view of the bonding structure of the present invention, figure 2 It is a combined schematic diagram of the bonding structure of the present invention, image 3 for figure 2 Schematic diagram of the cross-sectional structure of the bonded structure along the line III-III. In this embodiment, the adhesive structure 10 is preferably applied to a touch display device, such as a touch mobile phone or a tablet computer, for connecting the touch module in the touch display device with other modules, such as a display module. Snug connection. It can be understood that the bonding structure 10 can also be applied to other modules to be bonded, and is not limited to touch display devices.

[0014] The adhesive structure 10 includes a carrier film 100 , a first protective film 200 , a buffer layer 300 , a first adhesive layer 400 , a second protective film 500 , a second adhesive layer 600 and a ...

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Abstract

The invention relates to an adhesive structure, comprising a bearing film, a buffer layer with an opening, a first adhesive layer and a release film, wherein the bearing film and the first adhesive layer are disposed at two opposite surfaces of the buffer layer; the surface of the bearing film close to the first adhesive layer is coated by a first protective film; the first protective film is disposed at the opening of the buffer layer; and the release film is disposed on the surface of the first adhesive layer far away the surface of the buffer layer. The adhesive structure also comprises a second protective film which is disposed on the surface of the release film close to the first adhesive layer, so as to prevent mutual contact between the release film and the first protective film.

Description

technical field [0001] The invention relates to an adhesive structure applied to a touch display device. Background technique [0002] Existing touch display devices, such as mobile phones and tablet computers with touch functions, need to be connected with an adhesive structure in order to effectively bond the touch module receiving the touch operation and the display module. To achieve fit, sealing and other effects. However, in practical applications, after the touch module and the display module are assembled, it is often found that the viscous substance in the adhesive structure will adhere or transfer to the surface of the touch module or the display module, for example The release agent in the bonding structure will be transferred to the sensing substrate of the touch module, causing defects in the appearance and quality of the touch module. Contents of the invention [0003] In view of this, an adhesive structure capable of preventing contamination or transfer de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/06G06F3/041
Inventor 张菁韦英
Owner INTERFACE TECH CHENGDU CO LTD