Modified flexible substrate packaging device

A substrate sealing and flexible technology, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of large package volume, affecting the packaging and carrying of microelectronic substrates, and reducing the package volume.

Inactive Publication Date: 2013-09-18
NAT CENT FOR ADVANCED PACKAGING
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of microelectronics technology and the complexity and diversification of microelectronic processing functions, the integration density of electronic components in the substrate in microelectronics is increasing, which will inevitably increase the volume of microelectronic packages and affect the performance of microelectronic substrates. Packaging and carrying, a flexible electronic technology has been developed in the prior art. The microelectronic substrate adopts a flexible substrate. The flexible substrate not only has the insulation characteristics of the traditional rigid substrate, but also has the characteristics that the rigid substrate does not have, such as flexibility, so that The substrate itself is foldable, which greatly reduces the volume of the package and ensures the packaging and carrying of the microelectronic substrate. However, the bendable and foldable packaging method of the ordinary flexible substrate can only be bent once, so that the flexible substrate can only be bent once. It can form a structure of upper and lower layers, and the volume of the package body after flexible substrate packaging is relatively large

Method used

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  • Modified flexible substrate packaging device

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Embodiment Construction

[0011] See figure 1 , figure 2 As shown, an improved flexible substrate packaging device includes U-shaped packaging heads 1-1 and 1-2 on both sides, and the U-shaped packaging heads 1-1 and 1-2 on both sides can move toward each other. The U-shaped packaging heads 1-1, 1-2 are not equal in size, one end 1-1a, 1-2a of the U-shaped packaging heads 1-1, 1-2 on both sides corresponds, and the other end 1-2b of the small packaging head corresponds to Recess 2 in the large package header corresponds.

[0012] See figure 1 , figure 2 , image 3 , Figure 4 , the U-shaped packaging heads 1-1 and 1-2 are respectively provided with cavities 3, the inner side of the cavity 3 is provided with a through hole 4, and the outer side of the cavity 3 is provided with a suction port 5, which can ensure the stable suction of the flexible substrate Inside the U-shaped package head.

[0013] Due to the unequal size of the U-shaped packaging heads on both sides, through the relative moveme...

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Abstract

The invention provides a modified flexible substrate packaging device. Through the modified flexible substrate packaging device, the size of package of a packaged flexible substrate can be reduced effectively. The modified flexible substrate packaging device comprises U-shaped package heads on two sides. The package heads on two sides can move towards each other. The modified flexible substrate packaging device is characterized in that the U-shaped package heads on two sides are unequal in size, one end of one U-shaped package head faces to one end of the other U-shaped package head, and the other end of the small package head corresponds to a socket of the large package head.

Description

technical field [0001] The invention relates to the technical field of substrate packaging in the microelectronics industry, in particular to an improved flexible substrate packaging device. Background technique [0002] With the development of microelectronics technology and the complexity and diversification of microelectronic processing functions, the integration density of electronic components in the substrate in microelectronics is increasing, which will inevitably increase the volume of microelectronic packages and affect the performance of microelectronic substrates. Packaging and carrying, a flexible electronic technology has been developed in the prior art. The microelectronic substrate adopts a flexible substrate. The flexible substrate not only has the insulation characteristics of the traditional rigid substrate, but also has the characteristics that the rigid substrate does not have, such as flexibility, so that The substrate itself is foldable, which greatly r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 张博陆原尹雯
Owner NAT CENT FOR ADVANCED PACKAGING
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