Spraying device for LED (Light Emitting Diode)

A technology of spraying device and LED chip, which is applied in the direction of spraying device, device for coating liquid on the surface, coating, etc., which can solve the problems of poor quality of LED package, avoid pressing welding wire and improve quality

Active Publication Date: 2013-10-09
YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the substrate 13 is also provided with bonding wires 14, and the maximum distance between the bonding wires 14 and the substrate 13 is greater than the thickness of the chip 15, and the steel mesh 12 laid on the substrate 13 will press the bonding wires 14, making the quality of the LED package poor.

Method used

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  • Spraying device for LED (Light Emitting Diode)
  • Spraying device for LED (Light Emitting Diode)
  • Spraying device for LED (Light Emitting Diode)

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Embodiment Construction

[0021] The embodiment of the present invention provides a spray coating device for LEDs, which avoids pressing welding wires by steel mesh and improves the quality of LED packages.

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] The LED spraying device provided by the embodiment of the present invention includes: a sprayer 21 and a steel mesh 22 for laying on a substrate 24 for packaging LED chips. Mesh hole 221 ; the LED spraying device also includes: a support 23 for connecting with the substrate...

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Abstract

The invention provides a spraying device for an LED (Light Emitting Diode). The spraying device comprises a sprayer and a steel mesh, wherein the steel mesh is used for being laid on a substrate for packaging LED chips, and is provided with mesh holes which are consistently distributed with the chips on the substrate. The spraying device also comprises supporting pieces which are used for connection with the substrate and supporting the steel mesh; the height of each supporting piece is more than or equal to that of a welding line on the substrate. The spraying device provided by the invention has the advantages that since the supporting pieces for supporting the steel mesh is additionally arranged and the height of each supporting piece is more than or equal to that of the welding line on the substrate, the steel mesh supported by the supporting pieces is positioned above or at the top end of the welding line, and then the steel mesh can not press the welding lines, so that the steel mesh is prevented from pressing the welding lines, and further the quality of an LED packaging body is improved.

Description

technical field [0001] The invention relates to the technical field of LED fluorescent powder spraying, and more specifically relates to a spraying device for LEDs. Background technique [0002] With the continuous advancement of science and technology, LED (light emitting diode) is gradually widely used in lighting, display and TV lighting decoration, among which substrate type LED is widely used. Such as figure 1 As shown, the substrate-type LED mainly includes: a substrate 13, a chip 15 disposed on the substrate 13, and a bonding wire 14; wherein, the bonding wire 14 is electrically connected to the chip 15, and one chip 15 is connected to two bonding wires 14, and two bonding wires 14 are connected to each other. The bonding wires 14 are respectively located on two sides of the chip 15 . [0003] During the manufacturing process, phosphor powder needs to be sprayed on the chip 15 to make the LED emit the desired light color. Phosphor powder spraying equipment mainly i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02B05B13/02
Inventor 黄勇鑫袁永刚
Owner YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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