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Data carrier for contactless data transmission and method for producing the same

A data carrier and data transmission technology, which is applied to record carriers used in machines, antenna supports/installation devices, loop antennas, etc., and can solve the problems of complex cost and density of smart cards.

Active Publication Date: 2013-10-23
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Due to the direct contact connection of the chip module to the chip connection of the coil pads of the antenna coil, although an overall relativ

Method used

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  • Data carrier for contactless data transmission and method for producing the same
  • Data carrier for contactless data transmission and method for producing the same
  • Data carrier for contactless data transmission and method for producing the same

Examples

Experimental program
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Embodiment Construction

[0034] figure 1 An exemplary embodiment of a data carrier 10 is shown in cross section. The chip is fixed on the substrate 20 via an adhesive layer 60 . Chip 30 has two connection pads 35 and is arranged on substrate 20 with its rear side facing away from connection pads 35 . A copper plated prepreg layer 40 is disposed over the chip 30 and the substrate 20 . Copper-clad prepreg layers are also known as RCC foils or resin-coated copper foils. In the copper-plated prepreg layer 40 two plated-through holes 50 are located above the connection pads 35 . In each case two plated-through holes 50 are located in the contact opening 45 . As an example, contact openings can be introduced into the copper-plated prepreg layer by laser drilling. The two plated-through holes 50 serve to produce an electrically conductive connection between the connection pads 35 of the chip 30 and the copper layer of the copper-clad prepreg layer 40 . An antenna structure 48 is formed in the copper la...

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PUM

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Abstract

The invention relates to a data carrier for contactless data transmission and a method for producing the same. The data carrier for contactless data transmission comprises a substrate, and a chip having at least one connecting pad, wherein the chip is arranged on the substrate with one side thereof which is away from the connecting pad, and a first copper-plated prepreg layer is arranged on the chip and at least partially arranged on the substrate and has a contact opening facing the connecting pad. A plated-through-hole is located in the contact opening and used for generating conductive connection between the connecting pad of the chip and a copper layer of the first copper-plated prepreg layer, wherein a first antenna structure is formed in the copper layer of the first copper-plated prepreg layer.

Description

[0001] related application [0002] This application is a continuation-in-part of co-pending US Patent Application No. 12 / 556,404, filed September 9, 2009. US Patent Application No. 12 / 556,404 claims priority benefit from German Patent Application No. 102008046407.4, filed September 9, 2008. The entire contents of US Patent Application No. 12 / 556,404 and German Patent Application No. 102008046407.4 are hereby incorporated by reference. Background technique [0003] Use of data with integrated circuits, for example in the form of credit cards, bank cards, cash payment cards, etc. carrier. In a large proportion of these data carriers, the power supply and / or the data exchange with external devices is effected by means of contacts via external contact areas of the electronic module. Since the contact areas for connecting the data carrier to the read / write device are exposed in the case of these data carriers, there is a risk that the contact areas become contaminated, whereby,...

Claims

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Application Information

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IPC IPC(8): G06K19/077H01Q1/22H01Q7/00
CPCG06K19/077G06K19/07783G06K19/07784
Inventor M.布希斯鲍姆J.赫格尔F.普施纳S.兰佩茨赖特
Owner INFINEON TECH AG