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Heat-dissipating resistor and its heat-dissipating module

A heat dissipation module and heat dissipation technology, applied in the direction of resistors, resistor components, circuits, etc., can solve the problem that other parts cannot be tolerated

Active Publication Date: 2016-10-05
FUTABA ELECTRIC +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the size of the electronic product must be thin, light and short, sometimes it is impossible to allow the existence of other parts (such as cooling fins) in the limited space

Method used

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  • Heat-dissipating resistor and its heat-dissipating module
  • Heat-dissipating resistor and its heat-dissipating module
  • Heat-dissipating resistor and its heat-dissipating module

Examples

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Embodiment Construction

[0033] In order to better understand the technical content of the present invention, specific embodiments are given and described as follows.

[0034] Please refer to figure 1 . The heat dissipation module 1 of the present invention includes: an accommodating portion 10 and at least one fixing hole 13 . The accommodating portion 10 includes a bottom surface 11 and a first side edge 12 , the first side edge 12 is perpendicular to the edge of the bottom surface 11 , and the first side edge 12 includes at least one notch 121 . The fixing hole 13 is located on the bottom surface 11 , and the fixing hole 13 is adjacent to the first side edge 12 .

[0035] Preferably, the heat dissipation module 1 further includes an insulating fixing base 20 . The insulating holder 20 includes at least one protruding portion 21 . The size and number of the protruding portion 21 correspond to the size and number of the fixing hole 13 , so that the protruding portion 21 is inserted into the fixing...

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PUM

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Abstract

The invention discloses a radiating resistor and a radiating module. The radiating module can cool a passive element and comprises a containing part and at least one fixing part, wherein a body of a resistor can be placed in the containing part; a fixing hole is formed in the bottom surface of the containing part; the fixing hole can fix the body of the resistor after encapsulation on the radiating module by use of an insulating fixing seat; a connection end of the resistor is positioned in a groove in the insulating fixing seat. The invention also discloses a radiating resistor with the radiating module.

Description

technical field [0001] The invention relates to a heat dissipation module and a heat dissipation type resistor with the heat dissipation module. Background technique [0002] With the vigorous development of various electronic products, especially electronic products are developing in the direction of thinning. Therefore, various components must also be short and thin, such as those used in LED TVs or cloud servers. However, under the requirement of a certain power wattage, each component is thinner and smaller, and the operating temperature of these components will be higher. [0003] Generally speaking, in order to reduce the high temperature generated by the components, the assemblers of the motherboard will design to install heat dissipation fins near the heating components to avoid overheating. However, when the size of the electronic product must be light, thin, and short, other parts (such as heat dissipation fins) cannot be tolerated in a limited space. [0004] I...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C1/084H01G2/08
Inventor 施延欣廖进忠
Owner FUTABA ELECTRIC
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