A printed circuit board and its manufacturing method and electronic device
A technology for printed circuit boards and manufacturing methods, applied in printed circuit parts, structural connection of printed circuits, multi-layer circuit manufacturing, etc., can solve problems such as poor drop resistance and lack of elasticity in the PCB area, and achieve strong drop resistance , Realize the effect of sticking devices on both sides and facilitating diversification
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[0037] The main realization principles, specific implementation modes and corresponding beneficial effects of the technical solutions of the embodiments of the present invention will be described in detail below in conjunction with each accompanying drawing.
[0038] In order to solve the problems existing in the prior art, the embodiment of the present invention provides a printed circuit board, such as figure 1 shown, including:
[0039] The first circuit board 101 whose etched flexibility parameter is the first parameter and the second circuit board 102 whose etched flexibility parameter is the second parameter, the first parameter is greater than the second parameter;
[0040] Wherein, the etched first circuit board 101 is connected to the etched second circuit board 102 .
[0041] When the etched second circuit board 102 includes at least two independent second circuit sub-boards 1021, at least two of the independent second circuit sub-boards 1021 pass through at least a...
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