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Apparatus and method for determining endpoint of process chamber cleaning process

A technology for processing chambers and equipment, which is applied in the field of substrate processing equipment, and can solve the problems of cumbersome methods, unnecessary use of substrates and resources, etc.

Active Publication Date: 2016-08-17
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is cumbersome and results in unnecessary use of substrates and resources

Method used

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  • Apparatus and method for determining endpoint of process chamber cleaning process
  • Apparatus and method for determining endpoint of process chamber cleaning process
  • Apparatus and method for determining endpoint of process chamber cleaning process

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Embodiment Construction

[0015] Embodiments of the present invention relate to methods and apparatus for determining the endpoint of a processing chamber cleaning process. Embodiments of the method and apparatus may advantageously provide accurate endpoint detection of the cleaning process such that loss of processing chamber components due to the cleaning process may be minimized while minimizing process failures due to insufficient cleaning of the processing chamber. drift and defects.

[0016] Various processing chambers can benefit from modifications in accordance with the teachings provided herein. figure 1 Is a schematic cross-sectional view of a semiconductor substrate processing chamber 100 suitable for performing the inventive methods disclosed herein, in accordance with some embodiments of the present invention. In the depicted embodiment, the processing chamber 100 is adapted to perform an epitaxial silicon deposition process. One such suitable reactor is the RP Epi reactor available from...

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Abstract

The present invention provides methods and apparatus for determining the endpoint of a processing chamber cleaning process. In some embodiments, a processing system with an endpoint detection system may include: a processing chamber having interior surfaces that require periodic cleaning due to processes performed in the processing chamber; and endpoint detection A system comprising a light detector positioned to detect light reflected off a first inner surface of the processing chamber; and a controller coupled to the light The detector is also arranged to determine the end of the cleaning process based on the detected reflected light.

Description

technical field [0001] Embodiments of the invention generally relate to substrate processing equipment. Background technique [0002] Typical processing in a substrate processing chamber results in the formation of various deposits on the processing chamber walls. These deposits are usually removed by performing a cleaning process in the chamber in the absence of the substrate. One such cleaning process, such as used in epitaxial deposition systems, involves hydrogen chloride (HCl) and high temperatures. [0003] The cleaning process must be performed for a sufficient time to ensure that the internal processing chamber surfaces and components are clean. In some cases, the cleaning process may be performed for an excessively long period of time, which not only removes unwanted deposits, but may result in substantial degradation of the chamber surfaces and components. On the other hand, if the cleaning process is performed for too short a period of time, substantial deposit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCC23C16/4405C23C16/52H01L21/67253H01L22/12B08B3/08B08B3/10B08B9/46G01N21/94G01N2021/8416
Inventor 巴拉苏布拉马尼恩·拉马钱德雷石井雅人阿伦·缪尔·亨特
Owner APPLIED MATERIALS INC