Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bulk wave resonator and manufacturing method thereof

A manufacturing method and resonator technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems of large deformation and lower Q value of piezoelectric bulk wave resonators, and achieve the effect of high Q value

Active Publication Date: 2017-10-24
TIANJIN UNIV
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Aiming at the problem in the related art that the deformation degree of the multilayer film structure of the piezoelectric bulk wave resonator is too large, resulting in a decrease in the Q value of the piezoelectric bulk wave resonator, the present invention proposes a piezoelectric bulk wave resonator and a manufacturing method thereof , can control the degree of deformation of the multilayer film structure of the piezoelectric bulk wave resonator, thereby ensuring a good bulk acoustic wave reflection effect and keeping the Q value at a high level

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bulk wave resonator and manufacturing method thereof
  • Bulk wave resonator and manufacturing method thereof
  • Bulk wave resonator and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0068] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention.

[0069] According to an embodiment of the present invention, a piezoelectric bulk wave resonator is provided.

[0070] Piezoelectric bulk wave resonators according to embodiments of the present invention may include:

[0071] A multi-layer structure, wherein the multi-layer structure includes a bottom electrode, a piezoelectric layer and an upper electrode;

[0072] a substrate, the surface of the substrate has at least one groove, the multilayer structure covers t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a piezoelectric bulk wave resonator and a manufacturing method thereof, wherein the piezoelectric bulk wave resonator comprises: a multilayer structure; a substrate, the surface of the substrate has at least one groove, and the multilayer structure covers at least a groove through which at least one cavity is formed to constitute the acoustic reflection structure of the piezoelectric bulk wave resonator; wherein, in each cavity, the multilayer structure is depressed toward the bottom of the cavity and does not contact the bottom of the cavity contact; or, the multilayer structure protrudes away from the bottom of the cavity, and the height of the protrusion is greater than or equal to a predetermined height of the protrusion. The present invention ensures that the upper and lower sides of the multilayer film structure of the piezoelectric bulk wave resonator have good air reflection interfaces by controlling the degree of downward depression and the height of the upper protrusion of the multilayer film structure in the piezoelectric bulk wave resonator, In this way, good bulk acoustic wave reflection effect is ensured, and the Q value is kept at a high level.

Description

technical field [0001] The present invention relates to the field of semiconductors, and in particular, to a piezoelectric bulk wave resonator and a method of manufacturing the same. Background technique [0002] The multilayer piezoelectric bulk wave resonator made by using the longitudinal resonance of the piezoelectric multilayer structure in the thickness direction has become a surface acoustic wave device and a quartz crystal resonator in mobile phone communication and high-speed serial data applications. a viable alternative. RF front-end BAW piezoelectric filters / duplexers offer superior filtering characteristics such as low insertion loss, steep transition band, large power handling, strong anti-electrostatic discharge (ESD) capability, and more. [0003] The piezoelectric bulk wave oscillator of high frequency multilayer film structure has ultra-low frequency temperature drift, and its advantages are: low phase noise, low power consumption and large bandwidth modul...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/58H03H3/02
Inventor 庞慰江源张孟伦张代化张浩
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products