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Test method and device for bending stiffness in high and low temperature environment

A bending stiffness, testing device technology, applied in measuring devices, using stable bending force to test material strength, using optical devices, etc., can solve the problem that the laser transmitter cannot be located on the component and follows the three-dimensional displacement of a certain point. , to achieve the effect of good real-time performance, strong reliability and convenient use

Inactive Publication Date: 2016-03-09
ZHEJIANG GONGSHANG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the stiffness test at high and low temperatures, the laser emitter cannot be located on the component, and the deformation of the machine base must also be taken into account during the test
The patent application number is 201110370253.4 for "three-dimensional deformation measurement device of the measured part in the high and low temperature box" and the patent application number is 201110370271.2 for the "high precision measurement system for three-dimensional small deformation of the mechanical device in the high and low temperature box" to provide a high and low temperature box The measurement method of three-dimensional deformation of components, but this kind of method can only follow the three-dimensional displacement of a certain point, and the stiffness test needs to obtain accurate loading force and the size of the moment arm

Method used

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  • Test method and device for bending stiffness in high and low temperature environment
  • Test method and device for bending stiffness in high and low temperature environment

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Embodiment Construction

[0028] With reference to the accompanying drawings, a bending stiffness test method and device in a high and low temperature environment, including a high-resolution camera 10, a high-rigidity rod 7, a laser measurement group, a force sensor 8, a lifting device 9, and the like.

[0029] The DUT 2 and its mounting base 5 are placed in the high and low temperature box 1, one end of the high rigidity rod 7 is fixedly connected with the lifting device 9, and the other end of the high rigidity rod 7 is a smooth spherical surface and Acting vertically on the tested object 2, a force sensor 8 is installed between the high rigidity rod 7 and the lifting device 9.

[0030] The high-resolution camera 10 is fixed on the observation window 11 at the top of the high-low temperature box 1, and a calibration point 12 is set at the root of the connection between the tested part 2 and the mounting base 5, and the distance between the calibration point 12 and the high-rigidity rod 7 is fixed. T...

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Abstract

The invention relates to a method and a device for testing the flexural rigidity under a high and low temperature environment. The device comprises a high-resolution camera, a high-rigidity rod, a lifting device, a laser measurement group, and a high and low temperature box, wherein a to-be-tested member is fixed in the high and low temperature box through a to-be-tested member installing base, the high-resolution camera is fixed on an observation window in the top of the high and low temperature box, the high-rigidity rod vertically penetrates through the high and low temperature box to act on the to-be-tested member, the upper end of the high-rigidity rod is fixedly connected with the lifting device through a force sensor, and the laser measurement group is fixed outside the high and low temperature box and is opposite to the observation window in the side surface of the high and low temperature box. A force is loaded by adopting the high-rigidity rod without changing the direction, the value of a moment arm is obtained by using the high-resolution camera, and the corner deformation is obtained by using the laser measurement group, and thus a bending moment-angle deformation curve of the flexural rigidity of the to-be-tested member is accurately obtained; the device is convenient to use, strong in reliability, good in instantaneity and high in measurement precision.

Description

technical field [0001] The invention relates to the field of bending stiffness testing of components under high and low temperature environmental conditions. Background technique [0002] Stiffness tests on structural parts are usually carried out at room temperature unless there are special requirements. Existing stiffness tests have many methods and structures according to different test requirements and application fields, but for components in high and low temperature environments Stiffness test, due to the deformation of test fixtures and loading mechanisms in high and low temperature environments, which will affect the loading of force, the measurement of moments and angles, and because of the overheating and cooling of the environment, most precision instruments or equipment for testing will It cannot be used normally and affects the testing work. [0003] At present, the bending stiffness test under high and low temperature is carried out in a high and low temperatu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/20G01B11/16
Inventor 谢毅
Owner ZHEJIANG GONGSHANG UNIVERSITY
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