Device for Accurately Measuring Bending Stiffness in High and Low Temperature Environments

Abstract

A device for accurately measuring bending rigidity in a high-and-low temperature environment comprises an optical lens, a high-rigidity rod, a three-dimensional mobile platform, a laser measurement group, a high-and-low temperature box and the like, wherein a measured part is fixed in the high-and-low temperature box through a measured part installing base, the high-rigidity rod vertically penetrates the high-and-low temperature box to act on the measured part, the upper end of the high-rigidity rod is fixedly connected with the three-dimensional mobile platform through a force sensor, the optical lens is vertically fixed on the high-rigidity rod through an installing base, and the laser measurement group is fixed outside the high-and-low temperature box and opposite to the position of an observation window on the side face of the high-and-low temperature box. The device adopts the movable high-rigidity rod to perform loading, ensures a force arm to be invariant through the optical lens, utilizes the laser measurement group to obtain angle deformation, accordingly obtains a bending moment-angle deformation curve of the bending rigidity of the measured part and is convenient to use, high in reliability, good in real-timeliness and high in measurement accuracy.

Description

technical field [0001] The invention relates to the field of bending stiffness testing of components under high and low temperature environmental conditions. Background technique [0002] Stiffness tests on structural parts are usually carried out at room temperature unless there are special requirements. Existing stiffness tests have many methods and structures according to different test requirements and application fields, but for components in high and low temperature environments Stiffness test, due to thermal expansion and contraction of test fixtures, loading mechanisms, etc. in high and low temperature environments will cause deformation, which will affect the loading of force, measurement of torque and angle, and because of the overheating and cooling of the environment, most of the tests use precision Instruments or equipment will not work normally, affecting the testing work. [0003] At present, the bending stiffness test under high and low temperature is carrie...

AI Technical Summary

Problems solved by technology

However, for the stiffness test at high and low temperatures, the laser emitter cannot be located on the component, and the deformation of the machine base must also be taken into account during the test

The patent application number is 201110370253.4 for "three-dimensional deformation measurement device of the measured part in the high and low temperature box" and the patent application number is 201110370271.2 for the "high precision measurement system for three-dimensional small deformation of the mechanical device in the high and low temperature box" to provide a high and low temperature box The measurement method of three-dimensional deformation of components, but this kind of method can only follow the three-dimensional displacement of a certain point, and the stiffness test needs to obtain accurate loading force and the size of the moment arm

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